公开(公告)号：US20180026609A1

公开(公告)日：2018-01-25

申请号：US15437868

申请日：2017-02-21

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe Scilla

IPC: H03K3/011 ,  G01B7/16

CPC classification number: H03K3/011 ,  G01B7/18 ,  G01L1/00 ,  G01R17/12 ,  H01L22/34 ,  H01L23/34

Abstract: A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.

公开(公告)号：US20140197517A1

公开(公告)日：2014-07-17

申请号：US14153616

申请日：2014-01-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giuseppe Scilla

IPC: H01L27/07 ,  H01L21/8228

CPC classification number: H01L27/0755 ,  H01C17/22 ,  H01L21/82285 ,  H01L23/5256 ,  H01L27/0802 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A trimming circuit is configured to carry out a trimming operation on a device portion of an integrated circuit device. The trimming circuit includes: shunt fuses wherein each shunt fuse is coupled in parallel to a trimming resistance, further resistances wherein each further resistance is coupled in parallel to a respective shunt fuse. The circuit is configured to allow the flow of the trimming current when the respective shunt fuse is burnt during the trimming operation.

Abstract translation: 修整电路被配置为对集成电路器件的器件部分进行修整操作。 微调电路包括：分流熔断器，其中每个并联熔丝与微调电阻并联耦合，进一步的电阻，其中每个另外的电阻并联耦合到相应的分流保险丝。 该电路被配置为当在修整操作期间相应的分流保险丝被烧时允许微调电流的流动。

公开(公告)号：US10250233B2

公开(公告)日：2019-04-02

申请号：US15437868

申请日：2017-02-21

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe Scilla

IPC: H03K3/011 ,  G01L1/00 ,  G01R17/12 ,  H01L23/34 ,  G01B7/16 ,  H01L21/66

Abstract: A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.

公开(公告)号：US09153578B2

公开(公告)日：2015-10-06

申请号：US14153616

申请日：2014-01-13

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe Scilla

IPC: H01L21/82 ,  H01L27/07 ,  H01L21/8228 ,  H01L23/525 ,  H01L27/08 ,  H01C17/22

CPC classification number: H01L27/0755 ,  H01C17/22 ,  H01L21/82285 ,  H01L23/5256 ,  H01L27/0802 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A trimming circuit is configured to carry out a trimming operation on a device portion of an integrated circuit device. The trimming circuit includes: shunt fuses wherein each shunt fuse is coupled in parallel to a trimming resistance, further resistances wherein each further resistance is coupled in parallel to a respective shunt fuse. The circuit is configured to allow the flow of the trimming current when the respective shunt fuse is burnt during the trimming operation.

Abstract translation: 修整电路被配置为对集成电路器件的器件部分进行修整操作。 微调电路包括：分流熔断器，其中每个并联熔丝与微调电阻并联耦合，进一步的电阻，其中每个另外的电阻并联耦合到相应的分流保险丝。 该电路被配置为当在修整操作期间相应的分流保险丝被烧时允许微调电流的流动。