公开(公告)号：US11534866B2

公开(公告)日：2022-12-27

申请号：US16721557

申请日：2019-12-19

Applicant: SUBARU CORPORATION

Inventor： Mayu Nakano ,  Takafumi Adachi

IPC: B23K26/356 ,  B23K26/12 ,  B23K26/0622

Abstract: According to one implementation, a laser peening processing apparatus includes a laser oscillator and an irradiation system. The laser oscillator oscillates a laser light. The irradiation system condenses the laser light with a lens and irradiates a workpiece with the condensed laser light. The irradiation system irradiates the workpiece with the laser light in a state where the workpiece has been exposed in an atmosphere without interposed liquid. Furthermore, according to one implementation, a laser peening processing method includes producing a product or a semi-product by laser peening processing of the workpiece using the above-mentioned laser peening processing apparatus.

公开(公告)号：US11911849B2

公开(公告)日：2024-02-27

申请号：US16513467

申请日：2019-07-16

Applicant: SUBARU CORPORATION

Inventor： Mayu Nakano

IPC: B23K26/356 ,  B23K26/146 ,  B23K26/14 ,  C21D10/00 ,  B23K26/00

CPC classification number: B23K26/356 ,  B23K26/146 ,  B23K26/1476 ,  C21D10/005 ,  B23K26/0006

Abstract: According to one implementation, a laser peening processing apparatus includes: a laser oscillator; and a nozzle. The laser oscillator oscillates a laser light. The nozzle focuses the laser light and irradiates a surface to be processed of a workpiece with the focused laser light while flowing a liquid toward the surface to be processed. A straightening part that straightens a flow of the liquid is disposed on the nozzle. Furthermore, according to one implementation, a laser peening processing method includes: oscillating a laser light; manufacturing a product or a semi-product by focusing the laser light and irradiating a surface to be processed of a workpiece with the focused laser light toward while flowing a liquid on the surface; and straightening the liquid using a straightening structure.