Electrostatic chuck device and production method for electrostatic chuck device

    公开(公告)号:US11837489B2

    公开(公告)日:2023-12-05

    申请号:US16981622

    申请日:2019-03-22

    CPC classification number: H01L21/6833 H01J37/32724 H01L21/68757

    Abstract: The electrostatic chuck device includes: a base having one main surface serving as a mounting surface on which a plate-shaped sample is mounted; and an electrode for electrostatic attraction provided on a side opposite to the mounting surface in the base or in an interior of the base, in which the electrode for electrostatic attraction is made of a composite sintered body that includes a matrix phase having insulation properties and a dispersed phase having a lower volume resistivity value than the matrix phase, in any cross section of the composite sintered body, a region of the dispersed phase, which is surrounded by the matrix phase and is independent, includes aggregated portions having a maximum Feret diameter of 30 μm or more, and one or more of the aggregated portions are present in a range of 2500 μm2 in any cross section of the sintered body.

    Electrostatic chuck device and method of manufacturing electrostatic chuck device

    公开(公告)号:US11328948B2

    公开(公告)日:2022-05-10

    申请号:US16761891

    申请日:2019-07-19

    Abstract: An electrostatic chuck device (1) including: an electrostatic chuck part (2) which includes a base material (11) having a mounting surface (11a) on which a plate-like sample W is mounted, and an internal electrostatic attraction electrode (13) which electrostatically attracts the plate-like sample (W) to the mounting surface (11a); a cooling base part (3) which is configured to cool the electrostatic chuck part (2); and an adhesive layer (4) which is interposed therebetween, in which a shape of the mounting surface of the base material (11) includes a concave surface (23) or a convex surface, which is a curved surface that gradually curves from a center (11b) of the mounting surface (11a) toward an outer periphery (11c) of the mounting surface (11a) and includes no inflection point, and an absolute value of a difference between a height of a center of the concave surface (23) or the convex surface from a position of a main surface (3a) of the cooling base part (3) as a reference and a height of an outer periphery of the concave surface (23) or the convex surface from the position of the main surface (3a) of the cooling base part (3) as a reference is 1 μm or higher and 30 μm or lower.

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