Electrostatic chuck device
    1.
    发明授权

    公开(公告)号:US12249492B2

    公开(公告)日:2025-03-11

    申请号:US17999823

    申请日:2021-05-27

    Abstract: An electrostatic chuck device includes: an electrostatic chuck plate having a dielectric substrate having a placement surface on which a wafer is placed and an adsorption electrode positioned in the dielectric substrate; a metal base supporting the electrostatic chuck plate from a back surface side opposite to the placement surface; and a focus ring installed on an outer peripheral portion of the electrostatic chuck plate and surrounding the placement surface. The electrostatic chuck plate has a ring adsorption region which is adsorbed to the focus ring and is located on a surface positioned on the same side as the placement surface and has a base adsorption region which is adsorbed to the metal base and located on a back surface opposite to the placement surface.

    Titanium oxide particles, and titanium oxide particle dispersion and cosmetics using same

    公开(公告)号:US10717658B2

    公开(公告)日:2020-07-21

    申请号:US16313426

    申请日:2017-06-28

    Abstract: Titanium oxide particles of the present invention include octahedral-shaped particles, in which each particle of the octahedral-shaped particles has line segments each of which connects two apexes which face each other and has a maximum value of the line segments, an average value of the maximum values is 300 nm or more and 1,000 nm or less, and a value (the average value of the maximum values/BET-converted average particle diameter) obtained by dividing the average value of the maximum values of the line segments by an average particle diameter converted from a BET specific surface area is 1.0 or more and 2.5 or less.

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