公开(公告)号：US20250014933A1

公开(公告)日：2025-01-09

申请号：US18710508

申请日：2022-11-07

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Keisuke MAEDA ,  Norito MORISHITA ,  Tetsuro ITAGAKI ,  Yoshiki YOSHIOKA

IPC: H01L21/683 ,  H01J37/32

Abstract: Provided is an electrostatic chuck device including: an electrostatic chuck plate including a dielectric substrate that includes a placement surface on which a sample is mounted and an adsorption electrode that is positioned inside the dielectric substrate; and a base that supports the electrostatic chuck plate from a side opposite to the placement surface, in which in the electrostatic chuck plate, a first through-hole through which gas is supplied to the placement surface is provided, a porous body that allows passage of the gas is inserted into the first through-hole, a first adhesive layer that bonds an inner peripheral surface of the first through-hole and an outer peripheral surface of the porous body to each other is provided between the inner peripheral surface and the outer peripheral surface, and a thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less, at least in a region of 0.1 mm from the placement surface.

公开(公告)号：US20250158543A1

公开(公告)日：2025-05-15

申请号：US18839434

申请日：2023-03-15

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yoshiki YOSHIOKA ,  Hironori KUGIMOTO ,  Kentaro TAKAHASHI

IPC: H02N13/00 ,  B22F5/00 ,  B22F7/06

Abstract: An electrostatic chuck member provided with a placement surface and a lower surface includes a first plate body, a second plate body, and a third plate body stacked in this order in a thickness direction and bonded to each other, a first electrode layer located between the first plate body and the second plate body, a power feeding portion bonding layer located between the second plate body and the third plate body, a first power feeding portion, and a second power feeding portion, in which the first power feeding portion connects the first electrode layer and the power feeding portion bonding layer, the second power feeding portion extends from the power feeding portion bonding layer to a lower surface side, and the first electrode layer and the second power feeding portion are electrically connected with the first power feeding portion and the power feeding portion bonding layer interposed therebetween.

公开(公告)号：US20190043746A1

公开(公告)日：2019-02-07

申请号：US16072750

申请日：2017-01-27

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Yoshiki YOSHIOKA ,  Nobuhiro HIDAKA ,  Hironori KUGIMOTO

IPC: H01L21/683 ,  H01J37/32 ,  C04B35/117 ,  C04B35/626 ,  C04B35/645

Abstract: Provided is a composite sintered body for an electrostatic chuck, which is not easily broken even if it is exposed to high-power plasma. Further, provided are an electrostatic chuck device using such a composite sintered body for an electrostatic chuck and a method of manufacturing a composite sintered body for an electrostatic chuck. The composite sintered body for an electrostatic chuck is a composite sintered body including an insulating ceramic and silicon carbide, in which crystal grains of the silicon carbide are dispersed in at least one selected from the group consisting of a crystal grain boundary and a crystal grain of a main phase formed by sintering crystal grains of the insulating ceramic.