公开(公告)号：US20180254211A1

公开(公告)日：2018-09-06

申请号：US15752863

申请日：2016-08-09

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru KOSAKAI ,  Shinichi MAETA ,  Keisuke MAEDA

IPC: H01L21/683 ,  H01L21/3065 ,  H02N13/00 ,  B23Q3/15 ,  H01L21/67

CPC classification number: H01L21/6833 ,  B23Q3/15 ,  H01L21/3065 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/683 ,  H01L21/6835 ,  H02N13/00

Abstract: An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

公开(公告)号：US20190019714A1

公开(公告)日：2019-01-17

申请号：US16070478

申请日：2017-01-18

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru KOSAKAI ,  Yukio MIURA ,  Kazunori ISHIMURA ,  Keisuke MAEDA ,  Hitoshi KOUNO ,  Yuuki KINPARA ,  Shinichi MAETA ,  Tomomi ITO

IPC: H01L21/683 ,  H01L21/67 ,  H02N13/00

Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

公开(公告)号：US20250014933A1

公开(公告)日：2025-01-09

申请号：US18710508

申请日：2022-11-07

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Keisuke MAEDA ,  Norito MORISHITA ,  Tetsuro ITAGAKI ,  Yoshiki YOSHIOKA

IPC: H01L21/683 ,  H01J37/32

Abstract: Provided is an electrostatic chuck device including: an electrostatic chuck plate including a dielectric substrate that includes a placement surface on which a sample is mounted and an adsorption electrode that is positioned inside the dielectric substrate; and a base that supports the electrostatic chuck plate from a side opposite to the placement surface, in which in the electrostatic chuck plate, a first through-hole through which gas is supplied to the placement surface is provided, a porous body that allows passage of the gas is inserted into the first through-hole, a first adhesive layer that bonds an inner peripheral surface of the first through-hole and an outer peripheral surface of the porous body to each other is provided between the inner peripheral surface and the outer peripheral surface, and a thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less, at least in a region of 0.1 mm from the placement surface.

公开(公告)号：US20230321968A1

公开(公告)日：2023-10-12

申请号：US18022268

申请日：2021-08-30

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Keisuke MAEDA ,  Yuuki KINPARA

IPC: B32B37/12 ,  B32B7/12 ,  B32B9/04 ,  H01L21/683

CPC classification number: B32B37/12 ,  B32B7/12 ,  B32B9/041 ,  B32B2255/26 ,  H01L21/6833 ,  B32B2309/02 ,  B32B2311/00 ,  B32B2307/304 ,  B32B2457/00 ,  B32B2315/02 ,  B32B2307/54

Abstract: A method for repairing an electrostatic chuck device that is formed by bonding an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal with a first adhesive layer sandwiched therebetween is provided. The method includes a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive.

公开(公告)号：US20180108555A1

公开(公告)日：2018-04-19

申请号：US15562850

申请日：2016-02-25

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru KOSAKAI ,  Shinichi MAETA ,  Keisuke MAEDA

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6875 ,  H01L21/68757

Abstract: An electrostatic chuck device includes: a placing plate having a placement surface on which a plate-like sample is placed on one side thereof; an electrostatic attraction electrode provided on the other side of the first ceramic plate; and a first organic insulating layer provided between the first ceramic plate and the electrostatic attraction electrode. The electrostatic chuck device further has a supporting plate provided between the first organic insulating layer and the electrostatic attraction electrode.

公开(公告)号：US20210308812A1

公开(公告)日：2021-10-07

申请号：US17264705

申请日：2019-08-02

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Keisuke MAEDA ,  Masaki OZAKI ,  Masayuki SHIOJIRI ,  Takeshi WATANABE ,  Shinchi MAETA ,  Yuuki KINPARA

IPC: B23Q3/15 ,  H01L21/683 ,  H01J37/32

Abstract: An electrostatic chuck device includes: a mounting table provided with a mounting surface; a focus ring; and a cooling element, in which a holding portion of the mounting table is provided with an annular groove portion surrounding the mounting table, a through-hole that is open on a bottom surface of the groove portion, upper surfaces on both sides of the groove portion in a width direction in the holding portion form a holding surface that comes into contact with the focus ring and holds the focus ring, the holding surface is composed of an inner peripheral surface located further on an inner periphery side than the groove portion and an outer peripheral surface located further on an outer periphery side than the groove portion, and the holding surface satisfies the following conditions (i) and (ii), wherein (i) the holding surface has a shape in which in a cross section in a thickness direction, a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive inclination or a negative inclination from the first point corresponding to the innermost periphery toward the second point corresponding to the outermost periphery, and satisfies 0≤| in the cross section of the holding surface in the thickness direction, a height of the first point corresponding to the innermost periphery−a height of the second point corresponding to the outermost periphery |≤10 μm, (ii) a leak area of the inner peripheral surface and a leak area of the outer peripheral surface are less than 0.7 mm2.

公开(公告)号：US20200273736A1

公开(公告)日：2020-08-27

申请号：US16649611

申请日：2018-09-12

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru KOSAKAI ,  Masaki OZAKI ,  Keisuke MAEDA

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  H01J37/32

Abstract: An object of the present invention is to reduce non-uniformity of etching in a plane of a wafer. An electrostatic chuck device includes: an electrostatic chuck part having a sample mounting surface on which a sample is mounted and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample mounting surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the cooling base part has a function of a second electrode that is an RF electrode, a third electrode for RF electrode or LC adjustment is provided between the electrostatic chuck part and the cooling base part, and the third electrode is bonded to the electrostatic chuck part and the cooling base part and insulated from the cooling base part.

公开(公告)号：US20200266088A1

公开(公告)日：2020-08-20

申请号：US16649969

申请日：2018-09-26

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Mamoru KOSAKAI ,  Masaki OZAKI ,  Keisuke MAEDA

IPC: H01L21/683 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/768 ,  H01J37/32 ,  H02N13/00

Abstract: An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0 Ω/□ and lower than 1.0×1010 Ω/□.

公开(公告)号：US20180057655A1

公开(公告)日：2018-03-01

申请号：US15558564

申请日：2016-05-10

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Ryo KIKUTA ,  Keisuke MAEDA

IPC: C08K3/22

Abstract: Provided is a transparent resin composition having a higher heat ray-shielding effect that can particularly effectively shield light of a wavelength of 1,450 nm to 1,750 nm while ensuring a high visible light transmittance. The transparent resin composition contains a transparent resin-forming component and inorganic particles, in which the inorganic particles contain indium tin oxide (ITO) and have a color having an L* value of 30 or more and 55 or less and a b* value of −18 or more and −10 or less in the Lab color space.