WAFER SUPPORT DEVICE
    3.
    发明申请

    公开(公告)号:US20240429032A1

    公开(公告)日:2024-12-26

    申请号:US18827152

    申请日:2024-09-06

    Abstract: A wafer support device includes a dielectric substrate and an RF electrode provided in the dielectric substrate. The RF electrode is divided into a plurality of zone electrodes arranged in a planar direction of the dielectric substrate. The wafer support device has: a short-circuit member interconnecting the plurality of zone electrodes; and a main power supply rod connected to the short-circuit member from a back side of the dielectric substrate.

    ELECTROSTATIC CHUCK DEVICE
    5.
    发明申请

    公开(公告)号:US20250014933A1

    公开(公告)日:2025-01-09

    申请号:US18710508

    申请日:2022-11-07

    Abstract: Provided is an electrostatic chuck device including: an electrostatic chuck plate including a dielectric substrate that includes a placement surface on which a sample is mounted and an adsorption electrode that is positioned inside the dielectric substrate; and a base that supports the electrostatic chuck plate from a side opposite to the placement surface, in which in the electrostatic chuck plate, a first through-hole through which gas is supplied to the placement surface is provided, a porous body that allows passage of the gas is inserted into the first through-hole, a first adhesive layer that bonds an inner peripheral surface of the first through-hole and an outer peripheral surface of the porous body to each other is provided between the inner peripheral surface and the outer peripheral surface, and a thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less, at least in a region of 0.1 mm from the placement surface.

    ELECTROSTATIC CHUCK DEVICE
    7.
    发明公开

    公开(公告)号:US20230215704A1

    公开(公告)日:2023-07-06

    申请号:US17999823

    申请日:2021-05-27

    Abstract: An electrostatic chuck device includes: an electrostatic chuck plate having a dielectric substrate having a placement surface on which a wafer is placed and an adsorption electrode positioned in the dielectric substrate; a metal base supporting the electrostatic chuck plate from a back surface side opposite to the placement surface; and a focus ring installed on an outer peripheral portion of the electrostatic chuck plate and surrounding the placement surface. The electrostatic chuck plate has a ring adsorption region which is adsorbed to the focus ring and is located on a surface positioned on the same side as the placement surface and has a base adsorption region which is adsorbed to the metal base and located on a back surface opposite to the placement surface.

    TITANIUM OXIDE PARTICLES, AND TITANIUM OXIDE PARTICLE DISPERSION AND COSMETICS USING SAME

    公开(公告)号:US20190161360A1

    公开(公告)日:2019-05-30

    申请号:US16313426

    申请日:2017-06-28

    Abstract: Titanium oxide particles of the present invention include octahedral-shaped particles, in which each particle of the octahedral-shaped particles has line segments each of which connects two apexes which face each other and has a maximum value of the line segments, an average value of the maximum values is 300 nm or more and 1,000 nm or less, and a value (the average value of the maximum values/BET-converted average particle diameter) obtained by dividing the average value of the maximum values of the line segments by an average particle diameter converted from a BET specific surface area is 1.0 or more and 2.5 or less.

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