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    Fluid Ejection Assembly and Related Methods
    1.
    发明申请
    Fluid Ejection Assembly and Related Methods 有权
    流体喷射组件及相关方法

    公开(公告)号：US20130286105A1

    公开(公告)日：2013-10-31

    申请号：US13978768

    申请日：2011-01-31

    申请人： Sadiq Bengali ,  Galen P. Cook ,  Michael W. Cumbie ,  Robert K. Messenger

    发明人： Sadiq Bengali ,  Galen P. Cook ,  Michael W. Cumbie ,  Robert K. Messenger

    IPC分类号： B41J2/05 ,  B41J2/16

    CPC分类号： B41J2/05 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1645 ,  B41J2002/14467

    摘要： In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.

    摘要翻译： 在一个实施例中，流体喷射装置包括具有流体狭槽的基底和附着到跨越流体狭槽的基底的膜。 电阻器设置在流体槽上的膜的顶部上，并且电阻旁边的流体供给孔延伸穿过膜到槽。 一个搁板从电阻器的边缘延伸到馈电孔的边缘，钝化层覆盖电阻器和部件。 防腐蚀层部分地形成在搁板上并且在流体供给孔和电阻器之间。

    FLUID NOZZLE ARRAY
    2.
    发明申请
    FLUID NOZZLE ARRAY 有权
    流体喷嘴阵列

    公开(公告)号：US20130162717A1

    公开(公告)日：2013-06-27

    申请号：US13821204

    申请日：2010-09-15

    申请人： Sadiq Bengali ,  Chien-Hua Chen ,  Galen P. Cook ,  Michael W. Cumbie ,  Robert K. Messenger

    发明人： Sadiq Bengali ,  Chien-Hua Chen ,  Galen P. Cook ,  Michael W. Cumbie ,  Robert K. Messenger

    IPC分类号： B41J2/16 ,  B41J2/14

    CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1634

    摘要： A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.

    摘要翻译： 用于制造流体喷嘴阵列的方法包括在基底上形成电路层，所述基底包括设置在膜层和手柄层之间的阻挡层，形成从膜层的表面延伸到止动层的流体供给孔， 以及形成从手柄层的表面延伸到止挡层的流体供给沟槽。 一种流体喷嘴阵列包括：基材，其包括膜层，与膜层相邻的停止层，与停止层相邻的手柄层，以及一组流体室，其设置在膜层的表面上方并沿其宽度 从手柄层的表面延伸到止挡层的流体供应沟槽。

    Fluid nozzle array
    3.
    发明授权
    Fluid nozzle array 有权
    流体喷嘴阵列

    公开(公告)号：US08690295B2

    公开(公告)日：2014-04-08

    申请号：US13821204

    申请日：2010-09-15

    申请人： Sadiq Bengali ,  Chien-Hua Chen ,  Galen P. Cook ,  Michael W. Cumbie ,  Robert K. Messenger

    发明人： Sadiq Bengali ,  Chien-Hua Chen ,  Galen P. Cook ,  Michael W. Cumbie ,  Robert K. Messenger

    IPC分类号： B41J2/14

    CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1634

    摘要： A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.

    摘要翻译： 用于制造流体喷嘴阵列的方法包括在基底上形成电路层，所述基底包括设置在膜层和手柄层之间的阻挡层，形成从膜层的表面延伸到止动层的流体供给孔， 以及形成从手柄层的表面延伸到止挡层的流体供给沟槽。 一种流体喷嘴阵列包括：基材，其包括膜层，与膜层相邻的停止层，与停止层相邻的手柄层，以及一组流体室，其设置在膜层的表面上方并沿其宽度 从手柄层的表面延伸到止挡层的流体供应沟槽。

    Fluid ejection device with electrodes to generate electric field within chamber
    6.
    发明授权
    Fluid ejection device with electrodes to generate electric field within chamber 有权
    具有电极的流体喷射装置在室内产生电场

    公开(公告)号：US08210654B2

    公开(公告)日：2012-07-03

    申请号：US12789612

    申请日：2010-05-28

    申请人： Qingqiao Wei ,  Michael W. Cumbie

    发明人： Qingqiao Wei ,  Michael W. Cumbie

    IPC分类号： B41J2/06

    CPC分类号： B41J2/14016 ,  B41J2/175 ,  B41J2002/063

    摘要： A fluid ejection device includes a chamber, and first and second electrodes configured to generate an electric field within the chamber. A related method includes, in a firing chamber, separating whole ink into colloidal particles and ink vehicle such that the firing fluid within the chamber comprises primarily ink vehicle.

    摘要翻译： 流体喷射装置包括室，以及第一和第二电极，其被配置为在室内产生电场。 相关方法包括在烧制室中将整个油墨分离成胶体颗粒和油墨载体，使得室内的燃烧液主要包含油墨载体。

    FLUID EJECTION DEVICE
    7.
    发明申请
    FLUID EJECTION DEVICE 有权
    流体喷射装置

    公开(公告)号：US20110292131A1

    公开(公告)日：2011-12-01

    申请号：US12789612

    申请日：2010-05-28

    申请人： Qingqiao Wei ,  Michael W. Cumbie

    发明人： Qingqiao Wei ,  Michael W. Cumbie

    IPC分类号： B41J2/05 ,  B41J2/175

    CPC分类号： B41J2/14016 ,  B41J2/175 ,  B41J2002/063

    摘要： A fluid ejection device includes a chamber, and first and second electrodes configured to generate an electric field within the chamber. A related method includes, in a firing chamber, separating whole ink into colloidal particles and ink vehicle such that the firing fluid within the chamber comprises primarily ink vehicle.

    摘要翻译： 流体喷射装置包括腔室，以及构造成在腔室内产生电场的第一和第二电极。 相关方法包括在烧制室中将整个油墨分离成胶体颗粒和油墨载体，使得室内的燃烧液主要包含油墨载体。