LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

    公开(公告)号:US20230191533A1

    公开(公告)日:2023-06-22

    申请号:US17888717

    申请日:2022-08-16

    CPC classification number: B23K26/082 B23K26/0648 B23K26/0643

    Abstract: A laser processing apparatus includes a laser source; a width adjuster that adjusts a width of a laser beam irradiated from the laser source; and a scanner that adjusts an irradiation direction of the laser beam having passed through the width adjuster, wherein the width adjuster includes a first width adjusting portion and a second width adjusting portion arranged on a traveling direction of the laser beam, a focal length of the first width adjusting portion is equal to or greater that about 20,000 mm and a focal length of the second width adjusting portion is equal to or greater than about 20,000 mm.

    LASER CRYSTALLIZATION APPARATUS
    2.
    发明申请

    公开(公告)号:US20220214531A1

    公开(公告)日:2022-07-07

    申请号:US17509300

    申请日:2021-10-25

    Abstract: A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.

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