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公开(公告)号：US20240360031A1
公开(公告)日：2024-10-31
申请号：US18443043
申请日：2024-02-15
发明人： SOUKJUNE HWANG , DONGJO KIM , HYUN KIM , SEONGGEUN WON , JEWON YOO , SEUNGMIN LEE , DANBI CHOI
CPC分类号： C03C15/00 , B24C1/04 , C03C23/002 , H01L33/005 , C03C2218/355 , H01L2933/005
摘要： In a method of manufacturing a display device, the method includes: forming a patterning film on a back surface of a glass; patterning the patterning film to expose a bending area of the glass; forming a groove overlapping the bending area on a back surface of the glass by providing abrasive particles to the exposed glass; forming an acid-resistant film on a front surface of the glass; and etching the glass.
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公开(公告)号：US20220285656A1
公开(公告)日：2022-09-08
申请号：US17517887
申请日：2021-11-03
发明人： YOUNGKI CHAI , DONGJO KIM , YOUNGJI KIM , SEONGGEUN WON , DANBI CHOI , YOUNG SEO CHOI , SOUKJUNE HWANG
摘要： A display device with increased light transmittance to a functional module includes a substrate, a light blocking layer, an insulating layer, emission elements, and a polarization member. The substrate includes a first display region including a first pixel region and a transmission region, and a second display region surrounding at least a portion of the first display region and including a second pixel region. The light blocking layer is disposed in both display regions on the substrate and includes a first opening overlapping the transmission region. The insulating layer covers the light blocking layer on the substrate. The emission elements are disposed in the first and second pixel regions on the insulating layer. The polarization member is disposed on the emission elements and includes a second opening overlapping die first opening. An area of the second opening is greater than or equal to an area of the first opening.
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3.发明申请公开(公告)号：US20170219868A1
公开(公告)日：2017-08-03
申请号：US15485667
申请日：2017-04-12
发明人： HYUNWOO KOO , TAEWOONG KIM , SUNHO KIM , DANBI CHOI
IPC分类号： G02F1/1333 , B29C70/88
CPC分类号： G02F1/133305 , B29C70/88 , B29K2079/08 , B29K2083/00 , B29L2009/00 , B29L2031/3475 , G02F1/1339 , G02F1/1341 , G02F1/134309 , G02F1/13439 , G02F1/136286 , G02F1/1368 , G02F2001/13415 , G02F2201/121 , G02F2201/123 , G02F2202/023 , G02F2202/28 , Y10T428/1064
摘要： A device substrate manufacturing method includes forming a debonding layer on a carrier substrate. An inorganic adhesive layer is formed on at least a portion of the debonding layer. A process substrate is formed on the carrier substrate. A device is formed on the process substrate, and the process substrate is separated from the carrier substrate.
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