公开(公告)号：US20220384219A1

公开(公告)日：2022-12-01

申请号：US17588535

申请日：2022-01-31

Applicant: Samsung Display Co., LTD.

Inventor： Heung Yeol NA ,  Tae Hun KIM ,  Jung Woo CHOI

IPC: H01L21/67 ,  B23K26/00 ,  B65H23/00 ,  B65H75/44 ,  B23K26/12 ,  B23K26/16

Abstract: A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.