ELECTROSTATIC CHUCK AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240322713A1

    公开(公告)日:2024-09-26

    申请号:US18396845

    申请日:2023-12-27

    CPC classification number: H02N13/00 B05C13/00 B05C21/005

    Abstract: A thin film deposition apparatus according to an embodiment includes a chamber, a deposition source disposed in a chamber and that supplies a deposition material to the substrate, a mask assembly comprising pattern holes through which the deposition material passes, and an electrostatic chuck facing the mask assembly and that fixes the substrate. The electrostatic chuck comprises a body that supports the substrate, an insulating layer disposed on the body, a first electrode disposed in the insulating layer and spaced apart from the body by a first distance, a second electrode disposed in the insulating layer and spaced apart from the body by a second distance, and a conductive layer disposed in the insulating layer and spaced apart from the body by a third distance. The first electrode and the second electrode are supplied with different voltages, and the third distance is greater than the first distance.

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