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公开(公告)号:US20220204846A1
公开(公告)日:2022-06-30
申请号:US17388712
申请日:2021-07-29
发明人: JONGHEE PARK , HYOUNG SIK KIM , O Byoung Kwon , Gi-Yong Nam , Kyungchan Min , SUCK JUN LEE , YOUNGMIN KIM , JINHYUNG KIM , DONGHUN LEE , KYU-HUN LIM , DONGMIN JANG
摘要: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
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公开(公告)号:US20230220280A1
公开(公告)日:2023-07-13
申请号:US18122706
申请日:2023-03-17
发明人: JONGHEE PARK , HYOUNG SIK KIM , O Byoung Kwon , Gi-Yong Nam , Kyungchan Min , SUCK JUN LEE , YOUNGMIN KIM , JINHYUNG KIM , DONGHUN LEE , KYU-HUN LIM , DONGMIN JANG
CPC分类号: H10K71/621 , C09K13/06 , H10K59/1201
摘要: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
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