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公开(公告)号:US11639470B2
公开(公告)日:2023-05-02
申请号:US17388712
申请日:2021-07-29
Applicant: Samsung Display Co., Ltd.
Inventor: Jonghee Park , Hyoung Sik Kim , O Byoung Kwon , Gi-Yong Nam , Kyungchan Min , Suck Jun Lee , Youngmin Kim , Jinhyung Kim , Donghun Lee , Kyu-Hun Lim , Dongmin Jang
Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
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公开(公告)号:US20230220280A1
公开(公告)日:2023-07-13
申请号:US18122706
申请日:2023-03-17
Applicant: Samsung Display Co., Ltd.
Inventor: JONGHEE PARK , HYOUNG SIK KIM , O Byoung Kwon , Gi-Yong Nam , Kyungchan Min , SUCK JUN LEE , YOUNGMIN KIM , JINHYUNG KIM , DONGHUN LEE , KYU-HUN LIM , DONGMIN JANG
CPC classification number: H10K71/621 , C09K13/06 , H10K59/1201
Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
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公开(公告)号:US12031076B2
公开(公告)日:2024-07-09
申请号:US18122706
申请日:2023-03-17
Applicant: Samsung Display Co., Ltd.
Inventor: Jonghee Park , Hyoung Sik Kim , O Byoung Kwon , Gi-Yong Nam , Kyungchan Min , Suck Jun Lee , Youngmin Kim , Jinhyung Kim , Donghun Lee , Kyu-Hun Lim , Dongmin Jang
CPC classification number: C09K13/06 , C23F1/02 , C23F1/44 , H10K59/1201 , H10K71/233 , H10K71/621
Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
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公开(公告)号:US20220204846A1
公开(公告)日:2022-06-30
申请号:US17388712
申请日:2021-07-29
Applicant: Samsung Display Co., Ltd.
Inventor: JONGHEE PARK , HYOUNG SIK KIM , O Byoung Kwon , Gi-Yong Nam , Kyungchan Min , SUCK JUN LEE , YOUNGMIN KIM , JINHYUNG KIM , DONGHUN LEE , KYU-HUN LIM , DONGMIN JANG
Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
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