公开(公告)号：US20180063956A1

公开(公告)日：2018-03-01

申请号：US15581923

申请日：2017-04-28

Applicant: Samsung Display Co., Ltd.

Inventor： Jin Sic MIN ,  Eun Cheol SON

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H01L23/00

CPC classification number: H05K1/144 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/83007 ,  H01L2224/83201 ,  H01L2224/92125 ,  H05K1/028 ,  H05K1/111 ,  H05K1/147 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/10128 ,  H05K2201/2036 ,  H05K2203/0278

Abstract: A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.