DISPLAY DEVICE
    3.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230225151A1

    公开(公告)日:2023-07-13

    申请号:US18183133

    申请日:2023-03-13

    Abstract: A display device includes: a base substrate including an active area, and a nonactive area including a crack dam arrangement area; a plurality of inorganic layers on the base substrate; and an encapsulation layer on the plurality of inorganic layers, and including an encapsulation inorganic layer, and an encapsulation organic layer on the encapsulation inorganic layer. The base substrate includes first substrate portions having a first thickness at the crack dam arrangement area, and a second substrate portion between adjacent ones of the first substrate portions and connected to the first substrate portions, the second substrate portion having a second thickness smaller than the first thickness. The plurality of inorganic layers are laminated to form an inorganic laminated film at the crack dam arrangement area; and the encapsulation inorganic layer is located over the first substrate portions and the second substrate portion, and includes at least one short circuit portion.

    DISPLAY DEVICE
    5.
    发明申请

    公开(公告)号:US20210257591A1

    公开(公告)日:2021-08-19

    申请号:US17161513

    申请日:2021-01-28

    Abstract: A display device includes: a base substrate including an active area, and a non-active area including a crack dam arrangement area; a plurality of inorganic layers on the base substrate; and an encapsulation layer on the plurality of inorganic layers, and including an encapsulation inorganic layer, and an encapsulation organic layer on the encapsulation inorganic layer. The base substrate includes first substrate portions having a first thickness at the crack dam arrangement area, and a second substrate portion between adjacent ones of the first substrate portions and connected to the first substrate portions, the second substrate portion having a second thickness smaller than the first thickness. The plurality of inorganic layers are laminated to form an inorganic laminated film at the crack dam arrangement area; and the encapsulation inorganic layer is located over the first substrate portions and the second substrate portion, and includes at least one short circuit portion.

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