公开(公告)号：US20150138494A1

公开(公告)日：2015-05-21

申请号：US14300397

申请日：2014-06-10

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： TaeHwan KIM ,  Myeonghee Kim ,  Youngbae Kim ,  Jong Seong Kim ,  Myunghwan Park ,  Jonghwan Lee

IPC: G02F1/1333 ,  H01L21/768 ,  G02F1/1339 ,  H01L27/12

CPC classification number: G02F1/133305 ,  G02F2202/22 ,  H01L21/02038 ,  H01L21/02172 ,  H01L21/02296 ,  H01L27/124 ,  H01L27/1262 ,  H01L27/1266

Abstract: The method of manufacturing a device substrate includes forming a surface modifying layer on a process substrate. The surface modifying layer has a different hydrophobicity from that of the process substrate. The process substrate is disposed on a carrier substrate. The surface modifying layer is disposed between the process substrate and the carrier substrate. A device is formed on the process substrate. The process substrate is separated from the carrier substrate.

Abstract translation: 制造器件衬底的方法包括在处理衬底上形成表面改性层。 表面改性层具有与处理基材不同的疏水性。 处理基板设置在载体基板上。 表面改性层设置在处理基板和载体基板之间。 在处理基板上形成器件。 将工艺衬底与载体衬底分离。

公开(公告)号：US20150290921A1

公开(公告)日：2015-10-15

申请号：US14602649

申请日：2015-01-22

Applicant: Samsung Display Co., Ltd.

Inventor： TaeHwan KIM ,  Boram LEE ,  Jonghwan LEE ,  Sangil KIM

IPC: B32B38/10 ,  B32B43/00

CPC classification number: B32B38/10 ,  B32B2307/202 ,  B32B2457/20

Abstract: A method of separating a device substrate from a carrier substrate on which said device substrate is disposed. A static electricity removal member is provided between the device substrate and the carrier substrate. The device substrate is separated from the carrier substrate. According to the above, since static electricity accumulating between the device substrate and the carrier substrate is removed by the static electricity removal member, the carrier substrate and the device substrate may be easily separated from each other. Thus, damage to the device due to static electricity when the carrier substrate and the device substrate are separated from each other may be prevented.

Abstract translation: 一种从设置有所述器件衬底的载体衬底分离器件衬底的方法。 在设备基板和载体基板之间设置静电去除构件。 将器件衬底与载体衬底分离。 根据上述，由于通过静电除去构件除去在器件基板和载体基板之间积聚的静电，因此载体基板和器件基板容易彼此分离。 因此，可以防止当载体衬底和器件衬底彼此分离时由静电引起的器件损坏。