METHOD OF MANUFACTURING DEVICE SUBSTRATE
    1.
    发明申请
    METHOD OF MANUFACTURING DEVICE SUBSTRATE 审中-公开
    制造器件基板的方法

    公开(公告)号:US20150290921A1

    公开(公告)日:2015-10-15

    申请号:US14602649

    申请日:2015-01-22

    CPC classification number: B32B38/10 B32B2307/202 B32B2457/20

    Abstract: A method of separating a device substrate from a carrier substrate on which said device substrate is disposed. A static electricity removal member is provided between the device substrate and the carrier substrate. The device substrate is separated from the carrier substrate. According to the above, since static electricity accumulating between the device substrate and the carrier substrate is removed by the static electricity removal member, the carrier substrate and the device substrate may be easily separated from each other. Thus, damage to the device due to static electricity when the carrier substrate and the device substrate are separated from each other may be prevented.

    Abstract translation: 一种从设置有所述器件衬底的载体衬底分离器件衬底的方法。 在设备基板和载体基板之间设置静电去除构件。 将器件衬底与载体衬底分离。 根据上述,由于通过静电除去构件除去在器件基板和载体基板之间积聚的静电,因此载体基板和器件基板容易彼此分离。 因此,可以防止当载体衬底和器件衬底彼此分离时由静电引起的器件损坏。

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