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公开(公告)号：US20210242595A1
公开(公告)日：2021-08-05
申请号：US16891265
申请日：2020-06-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Ho Kyung KANG , Seong Jong CHEON , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20210313672A1
公开(公告)日：2021-10-07
申请号：US17354425
申请日：2021-06-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Young Sik HUR , Yoo Sam NA , Won Gi KIM , Young Bal KIM , Soo Ki CHOI , Ho Kyung KANG , Young Kyoon IM , Seong Jong CHEON
Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.
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Patent Agency Ranking
公开(公告)号：US20210143525A1
公开(公告)日：2021-05-13
申请号：US16937981
申请日：2020-07-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Young Sik HUR , Yoo Sam NA , Won Gi KIM , Young Bal KIM , Soo Ki CHOI , Ho Kyung KANG , Young Kyoon IM , Seong Jong CHEON
Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.
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公开(公告)号：US20220037792A1
公开(公告)日：2022-02-03
申请号：US17505743
申请日：2021-10-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Ho Kyung KANG , Seong Jong CHEON , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20210257736A1
公开(公告)日：2021-08-19
申请号：US16890060
申请日：2020-06-02
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Shin Haeng HEO , Young Sik HUR , Hak Gu KIM
Abstract: A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.
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公开(公告)号：US20210242896A1
公开(公告)日：2021-08-05
申请号：US16994955
申请日：2020-08-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Ho Kyung KANG , Seong Jong CHEON , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
IPC: H04B1/40 , H01Q9/04 , H01Q1/22 , H01L23/66 , H01L25/065 , H01L23/538
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20210242594A1
公开(公告)日：2021-08-05
申请号：US16891200
申请日：2020-06-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung KANG , Seong Jong CHEON , Hak Gu KIM , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
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