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公开(公告)号：US20190229055A1
公开(公告)日：2019-07-25
申请号：US16107727
申请日：2018-08-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won Wook SO , Jin Seon PARK , Young Sik HUR , Yong Ho BAEK
IPC: H01L23/522 , H01L23/00 , H01L21/56
Abstract: A fan-out sensor package includes: a first semiconductor chip module including a first connection member having a first through-hole and a first wiring layer, a first semiconductor chip disposed in the first through-hole and having an active surface on which a sensing region and first connection pads are disposed, and an encapsulant encapsulating at least portions of the first connection member and the first semiconductor chip and filling at least portions of the first through-hole; a redistribution module having a second through-hole exposing at least a portion of the sensing region and including a redistribution layer; and electrical connection structures electrically connecting the first wiring layer and the first connection pads to the redistribution layer.
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公开(公告)号：US20210242595A1
公开(公告)日：2021-08-05
申请号：US16891265
申请日：2020-06-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Ho Kyung KANG , Seong Jong CHEON , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20170294469A1
公开(公告)日：2017-10-12
申请号：US15370604
申请日：2016-12-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Eun LEE , Jin Seon PARK , Yul Kyo CHUNG , Chul CHOI , Dae Young JUNG , Seung Yeop KOOK
IPC: H01L27/146 , H04N5/225 , H01L25/18
CPC classification number: H04N5/2253 , H01L24/20 , H01L25/18 , H01L27/14618 , H01L27/14625 , H01L2224/04105
Abstract: A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.
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公开(公告)号：US20150351247A1
公开(公告)日：2015-12-03
申请号：US14703856
申请日：2015-05-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Hee KWON , Myung Sam KANG , Seung Eun LEE , Ju Hee PARK , Seung Yeop KOOK , Je Gwang YOO , Jin Seon PARK
CPC classification number: H05K1/0231 , H01L23/49822 , H01L23/5389 , H01L2224/18 , H05K1/185 , H05K2201/10015 , Y10T29/49147
Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer formed with a penetrating cavity; a capacitor disposed in the cavity and including a first electrode, a second electrode formed on the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed on the first insulating layer and in the cavity to embed the capacitor; circuit layers formed on the first insulating layer and the second insulating layer; and a via penetrating through the second insulating layer to electrically connect the circuit layer to the capacitor.
Abstract translation: 提供了一种封装板及其制造方法。 根据本公开的示例性实施例，封装板包括：形成有穿透腔的第一绝缘层; 设置在所述空腔中并且包括第一电极，形成在所述第一电极上的第二电极和形成在所述第一电极和所述第二电极之间的电介质层的电容器; 第二绝缘层，形成在所述第一绝缘层和所述空腔中以嵌入所述电容器; 形成在第一绝缘层和第二绝缘层上的电路层; 以及穿过所述第二绝缘层以将所述电路层电连接到所述电容器的通孔。
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公开(公告)号：US20150351228A1
公开(公告)日：2015-12-03
申请号：US14463468
申请日：2014-08-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Seon PARK , Myung Sam Kang , Seung Eun Lee , Seung Yeop Kook , Ki Jung Sung , Ju Hee Park , Je Gwang Yoo
CPC classification number: H01L21/6835 , H01L21/486 , H01L23/49822 , H01L2221/68345 , H01L2224/18 , Y10T29/49131
Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer.
Abstract translation: 提供了一种封装板及其制造方法。 根据本公开的示例性实施例，封装板包括：第一绝缘层; 形成在第一绝缘层下面的第二绝缘层; 嵌入在所述第一绝缘层中并且包括形成在所述第一电极和所述第二电极之间的第一电极，第二电极和电介质层的电容器; 形成在第一绝缘层和第二绝缘层上的电路层; 以及形成在电容器和电路层之间或形成在第一绝缘层和第二绝缘层之间的电路层之间的通孔，以在其间电连接，其中形成第一电极的上表面以从第一绝缘层 。
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Patent Agency Ranking
公开(公告)号：US20220037792A1
公开(公告)日：2022-02-03
申请号：US17505743
申请日：2021-10-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Ho Kyung KANG , Seong Jong CHEON , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20210242896A1
公开(公告)日：2021-08-05
申请号：US16994955
申请日：2020-08-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hak Gu KIM , Ho Kyung KANG , Seong Jong CHEON , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
IPC: H04B1/40 , H01Q9/04 , H01Q1/22 , H01L23/66 , H01L25/065 , H01L23/538
Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
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公开(公告)号：US20210242594A1
公开(公告)日：2021-08-05
申请号：US16891200
申请日：2020-06-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho Kyung KANG , Seong Jong CHEON , Hak Gu KIM , Young Sik HUR , Jin Seon PARK , Yong Duk LEE
Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
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公开(公告)号：US20190173184A1
公开(公告)日：2019-06-06
申请号：US15949386
申请日：2018-04-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Doo Il KIM , Young Sik HUR , Yong Ho BAEK , Jin Seon PARK
IPC: H01Q9/04 , H01Q1/38 , G06K19/077 , H01Q23/00
Abstract: An antenna module includes a connection member, an integrated circuit (IC), a dielectric layer, antenna members, feed vias, and a plating member. The connection member includes one or more wiring layer(s) and insulating layer(s). The IC is disposed on one surface of the connection member and is electrically connected to the wiring layer(s). The dielectric layer is disposed on another surface of the connection member. The antenna members are disposed in the dielectric layer, and the feed vias are disposed in the dielectric layer so that each has one end electrically connected to a corresponding antenna member and the other end electrically connected to a corresponding one of the wiring layer(s). The plating member is disposed in the dielectric layer to surround side surfaces of the feed vias. The dielectric layer has a dielectric constant Dk greater than that of at least one insulating layer.
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公开(公告)号：US20190139912A1
公开(公告)日：2019-05-09
申请号：US15949439
申请日：2018-04-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Doo Il KIM , Yong Ho BAEK , Jin Seon PARK , Young Sik HUR
IPC: H01L23/66 , H01L23/31 , H01L23/538 , H01L23/552 , H01L23/00 , H01L21/48 , H01L21/56 , H01Q1/22 , H01Q1/24
Abstract: An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.
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