公开(公告)号：US20230163452A1

公开(公告)日：2023-05-25

申请号：US18080924

申请日：2022-12-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Bal KIM ,  Wan Soo KIM ,  Sang Hoon KIM

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q21/08 ,  H01Q9/28 ,  H01Q1/22 ,  H01Q21/28

CPC classification number: H01Q1/38 ,  H01Q1/248 ,  H01Q21/08 ,  H01Q9/285 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q21/28 ,  H01Q21/061

Abstract: An antenna module includes an integrated circuit (IC), a substrate having a first region having one or more antenna disposed on a surface thereof and a second region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more antenna and the IC, a set substrate electrically connected to the IC, and a set module disposed on the set substrate between the set substrate and the first region.

公开(公告)号：US20190036229A1

公开(公告)日：2019-01-31

申请号：US15987400

申请日：2018-05-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Bal KIM ,  Wan Soo KIM ,  Sang Hoon KIM

IPC: H01Q21/06 ,  H01Q1/38

CPC classification number: H01Q21/06 ,  H01Q1/085 ,  H01Q1/38 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/293

Abstract: An antenna module includes an integrated circuit (IC) that is configured to generate an RF signal, a substrate providing a first surface on which one or more first antenna is arranged, a second surface on which the IC is arranged, and an electrical connection path to the one or more first antenna and the IC, and a flexible substrate connected to the substrate to provide a third surface on which one or more second antenna is arranged and to provide an electrical connection path to the one or more second antenna and the IC.

公开(公告)号：US20210313672A1

公开(公告)日：2021-10-07

申请号：US17354425

申请日：2021-06-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hak Gu KIM ,  Young Sik HUR ,  Yoo Sam NA ,  Won Gi KIM ,  Young Bal KIM ,  Soo Ki CHOI ,  Ho Kyung KANG ,  Young Kyoon IM ,  Seong Jong CHEON

IPC: H01Q1/22 ,  H01Q1/08 ,  H01Q21/28 ,  H04B1/16 ,  H04B1/04

Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.

公开(公告)号：US20210143525A1

公开(公告)日：2021-05-13

申请号：US16937981

申请日：2020-07-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hak Gu KIM ,  Young Sik HUR ,  Yoo Sam NA ,  Won Gi KIM ,  Young Bal KIM ,  Soo Ki CHOI ,  Ho Kyung KANG ,  Young Kyoon IM ,  Seong Jong CHEON

IPC: H01Q1/22 ,  H01Q1/08 ,  H04B1/04 ,  H04B1/16 ,  H01Q21/28

Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.

公开(公告)号：US20210013624A1

公开(公告)日：2021-01-14

申请号：US17038123

申请日：2020-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Bal KIM ,  Wan Soo KIM ,  Sang Hoon KIM

IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q21/29 ,  H01Q1/08

Abstract: An antenna module includes an integrated circuit (IC) that is configured to generate an RF signal, a substrate providing a first surface on which one or more first antenna is arranged, a second surface on which the IC is arranged, and an electrical connection path to the one or more first antenna and the IC, and a flexible substrate connected to the substrate to provide a third surface on which one or more second antenna is arranged and to provide an electrical connection path to the one or more second antenna and the IC.

公开(公告)号：US20190036207A1

公开(公告)日：2019-01-31

申请号：US15994723

申请日：2018-05-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Bal KIM ,  Wan Soo KIM ,  Sang Hoon KIM

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/22 ,  H01Q9/28 ,  H01Q21/08

Abstract: An antenna module includes an integrated circuit (IC), a substrate having a first region having one or more antenna disposed on a surface thereof and a second region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more antenna and the IC, a set substrate electrically connected to the IC, and a set module disposed on the set substrate between the set substrate and the first region.