公开(公告)号：US20130213695A1

公开(公告)日：2013-08-22

申请号：US13771830

申请日：2013-02-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Han II KIM ,  Dek Gin YANG

IPC: H05K1/02

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Abstract translation: 本发明涉及一种制造飞尾型刚柔柔性印刷电路板的方法及其制造的飞尾型刚柔柔性印刷电路板，并实现具有改善填充性能的飞尾型刚挠性印刷电路板 通过提供一种制造飞尾型刚性 - 柔性印刷电路板的方法，包括：提供在两个表面上具有第一内部电路图案层的基底基板; 在基底基板的刚性区域R上层叠第一绝缘层; 将在基底衬底的整个区域上延伸的至少一个电路层层叠在第一绝缘层上; 并且去除对应于柔性域F的电路层的一部分，其中电路层包括第二绝缘层和由其制造的飞尾型刚柔柔性印刷电路板。