公开(公告)号：US20140165346A1

公开(公告)日：2014-06-19

申请号：US14185546

申请日：2014-02-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sang Youp LEE ,  Joung Gul RYU ,  Dong Sun KIM ,  Jae Hoon CHOI ,  In Ho SEO

IPC: H05K3/40

CPC classification number: H05K3/4007 ,  C25D5/02 ,  C25D5/12 ,  C25D5/48 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2203/0361 ,  Y10T29/302 ,  Y10T29/417 ,  H01L2924/00

Abstract: Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract translation: 本发明的实施例提供一种散热基板，包括：散热电路层，其由包含凹凸层的电解凹槽层和形成在所述凹凸层两侧的电解铜镀层形成; 绝热层，形成在散热电路层的两侧，使得散热电路层插入在绝缘层之间; 形成在绝缘层上的第一和第二电路层; 以及将散热电路层与第一电路层连接的第一凸块和将散热电路层与第二电路层连接的第二凸块。 散热基板表现出优异的散热效率并且可以变薄。