公开(公告)号：US20190139696A1

公开(公告)日：2019-05-09

申请号：US16233178

申请日：2018-12-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： In-Seok KIM ,  Yong-Jin PARK ,  Young-Gwan KO ,  Youn-Soo SEO ,  Myung-Sam KANG ,  Tae-Hong MIN

IPC: H01F27/32 ,  H01F41/04 ,  H01F27/255 ,  H01F17/00

Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.

公开(公告)号：US20160247624A1

公开(公告)日：2016-08-25

申请号：US15049639

申请日：2016-02-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Youn-Soo SEO ,  Myung-Sam KANG ,  Jin-Soo KIM ,  Young-Gwan KO ,  Woon-Chul CHOI ,  In-Seok KIM ,  Hye-Yeon CHA

IPC: H01F27/255 ,  H01F41/12 ,  H01F41/02 ,  H01F27/32 ,  H01F27/28

CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F27/324 ,  H01F41/046 ,  H01F2017/048

Abstract: Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.

Abstract translation: 芯片电子部件及其制造方法公开。 示例方面提供了一种芯片电子元件。 芯片电子部件包括：磁性体，包括磁性材料的磁体，嵌入在磁体中并形成为与第一线圈导体和第二线圈导体连接的线圈部，覆盖第一线圈导体和第二线圈导体的绝缘层 和形成在绝缘层上的磁性层。