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公开(公告)号：US20190139696A1
公开(公告)日：2019-05-09
申请号：US16233178
申请日：2018-12-27
发明人： In-Seok KIM , Yong-Jin PARK , Young-Gwan KO , Youn-Soo SEO , Myung-Sam KANG , Tae-Hong MIN
IPC分类号： H01F27/32 , H01F41/04 , H01F27/255 , H01F17/00
摘要： Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.
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公开(公告)号：US20160100485A1
公开(公告)日：2016-04-07
申请号：US14636076
申请日：2015-03-02
发明人： Hye-Won JUNG , Myung-Sam KANG , Yong-Wan JI , Yong-Jin PARK , Young-Gwan KO , Kang-Wook BONG
CPC分类号： H05K1/115 , H05K1/0221 , H05K3/0094 , H05K3/0097 , H05K3/10 , H05K3/429 , H05K3/4673 , H05K3/4682 , H05K2203/1536
摘要： Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground.
摘要翻译： 公开了印刷电路板和制造印刷电路板的方法，其包括：第一抗蚀剂层; 形成在第一抗蚀剂层上的第一电路; 绝缘膜，形成在所述第一抗蚀剂层上以覆盖所述第一电路的上表面和侧表面; 形成在所述绝缘膜上以与所述第一电路电连接的接地; 以及形成在绝缘膜上以覆盖地面的绝缘层。
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