公开(公告)号：US20140367147A1

公开(公告)日：2014-12-18

申请号：US14172242

申请日：2014-02-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok Moon ,  Hyun Jun Lee ,  Seong Hyun Yoo ,  Jin Young Klm ,  Geum Hee Yun

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0373 ,  H05K1/0353 ,  H05K3/4602 ,  H05K3/4676 ,  H05K2201/0141 ,  H05K2201/0209

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.

Abstract translation: 本文公开了用于印刷电路板，绝缘膜，预浸料和印刷电路板的绝缘树脂组合物。 更具体地，本文公开了一种用于印刷电路板的绝缘树脂组合物，其包括具有三个或更多个马来酰亚胺基团的马来酰亚胺树脂等，使得玻璃化转变温度和机械强度得到改善，绝缘膜和使用 绝缘树脂组合物和包括绝缘膜或预浸料的印刷电路板。