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    CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
    3.
    发明申请
    CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME 审中-公开
    使用其制造印刷电路板的载体和方法

    公开(公告)号：US20150107760A1

    公开(公告)日：2015-04-23

    申请号：US14160244

    申请日：2014-01-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Seok Moon ,  Dae Hui Jo ,  Keung Jin Sohn ,  Seong Hyun Yoo

    IPC: H05K3/46 ,  H05K1/03

    CPC classification number: H05K3/4682 ,  H05K3/007 ,  Y10T428/12569

    Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.

    Abstract translation: 这里公开了使用该印刷电路板的印刷电路板的载体和方法。 更具体地说，在本发明的载体中，载体具有由包含环氧树脂的绝缘层改善的热膨胀系数（CTE），玻璃化转变温度（Tg）和储能模量的特性， 液晶低聚物。 此外，在绝缘层上形成第一金属层，使得可以通过物理冲击保护堆叠在载体的一个表面或两个表面上的印刷电路板免受变形，并且可以使翘曲现象最小化。

    COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
    印刷电路板用铜箔层压板及其制造方法

    公开(公告)号：US20150060115A1

    公开(公告)日：2015-03-05

    申请号：US14079236

    申请日：2013-11-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sa Yong Lee ,  Jin Seok Moon ,  Keun Yong Lee

    IPC: H05K1/03 ,  H05K3/20 ,  H05K1/09 ,  H05K1/05

    CPC classification number: H05K1/036 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/308 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0271 ,  Y10T156/10 ,  Y10T428/249921

    Abstract: Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients.

    Abstract translation: 本发明公开了一种用于印刷电路板的覆铜层压板，其中在预浸料坯的两面上形成有玻璃纤维的复合体设置在第一树脂涂覆铜箔（RCC）的树脂层和树脂层 第二种树脂被覆铜箔，其结构是基于该复合物而使树脂层对称或不对称的结构及其制造方法。 覆铜层压板的厚度可以制造成所需的厚度，或者可以均匀地保持厚度，从而可以实现厚度质量的稳定化，可以提高铜箔和树脂之间的粘附性，并且可以调节翘曲 当层压具有不同上和下热膨胀系数的基板时。

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