公开(公告)号：US20210297609A1

公开(公告)日：2021-09-23

申请号：US17076041

申请日：2020-10-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hoon KIM ,  Joon Seok CHAE ,  Yun Tae LEE ,  Tae Kon KOO ,  Jae Chan LEE ,  Yong Woon PARK

IPC: H04N5/345 ,  H04N5/355 ,  G07C5/08

Abstract: A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.

公开(公告)号：US20150185176A1

公开(公告)日：2015-07-02

申请号：US14221007

申请日：2014-03-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kon KOO ,  Tae Hoon KIM

IPC: G01N27/22

CPC classification number: G01N27/223

Abstract: There is provided a humidity sensor including: a substrate including an insulation film deposited on a surface thereof; a lower electrode formed on the substrate and including a contact extension part; a moisture sensing layer formed of a polymer material, provided on the lower electrode, and partially exposed through the contact extension part; and an upper electrode formed on the moisture sensing layer and including an open portion so as to partially expose the moisture sensing layer, wherein the contact extension part is in communication with the outside so that external air contacts the moisture sensing layer exposed through the contact extension part.

Abstract translation: 提供了一种湿度传感器，包括：基板，其包括沉积在其表面上的绝缘膜; 形成在所述基板上并包括接触延伸部的下电极; 由聚合物材料形成的湿度感测层，设置在下部电极上，并通过接触延伸部分露出; 以及形成在所述湿度感测层上的上电极，并且包括开口部分以部分地暴露所述湿度感测层，其中所述接触延伸部分与外部连通，使得外部空气接触通过所述接触延伸部暴露的湿度感测层 部分。

公开(公告)号：US20150177028A1

公开(公告)日：2015-06-25

申请号：US14295963

申请日：2014-06-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sun Kyu LEE ,  Tae Kon KOO ,  Tae Hoon KIM ,  Kyu Hwan OH ,  Seog Moon CHOI

IPC: G01D11/24 ,  H01L35/00 ,  H01L23/495

CPC classification number: G01D11/245 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/495 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.

Abstract translation: 传感器封装可以允许流体平滑流动，从而增加响应特性。 传感器封装可以包括：端子部分; 至少一个电子元件通过接合线电连接到端子部分; 以及模制部件，其封装所述接合线和所述电子元件，并且包括部分地暴露所述电子元件的感测部分和将周围流体引导到所述感测部分的至少一个引导部。