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公开(公告)号：US20240107139A1
公开(公告)日：2024-03-28
申请号：US18109964
申请日：2023-02-15
发明人： Tae Hoon KIM
CPC分类号： H04N23/52 , G02B7/021 , G02B27/0006 , H04N23/55
摘要： A camera module, may include: a lens module including a forwardmost lens disposed closest to an object: a housing configured to accommodate the lens module; a heater formed on the forwardmost lens, and configured to heat the forwardmost lens by a first driving signal; and a dirt remover formed on the forwardmost lens, and configured to generate electrical vibrations or mechanical vibrations or a voltage difference to remove dirt attached to a surface of the forwardmost lens by a second driving signal.
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公开(公告)号：US20220252964A1
公开(公告)日：2022-08-11
申请号：US17410010
申请日：2021-08-24
发明人： Dae Seob KIM , Tae Hoon KIM
摘要： A camera module includes a first lens barrel configured to receive one or more lens groups, a second lens barrel coupled to the first lens barrel and configured to support a front lens disposed on an object side of the one or more lens groups, an energy generating unit configured to contact the second lens barrel and configured to supply thermal energy to the second lens barrel, and a barrel holder coupled to the first lens barrel and configured to accommodate the energy generating unit.
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公开(公告)号：US20180061555A1
公开(公告)日：2018-03-01
申请号：US15677923
申请日：2017-08-15
发明人： Jong Yoon JANG , Seok Hwan AHN , Jeong Min CHO , Tae Hoon KIM , Jin Gul HYUN , Se Woong PAENG
摘要： There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.
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公开(公告)号：US20180053719A1
公开(公告)日：2018-02-22
申请号：US15600114
申请日：2017-05-19
发明人： Tae Hyun KIM , Thomas A. KIM , Kyu Bum HAN , Tae Hoon KIM
IPC分类号： H01L23/522 , H01L23/532
CPC分类号： H01L23/5226 , H01L23/13 , H01L23/49816 , H01L23/53209 , H01L23/53214 , H01L23/53219 , H01L23/53228 , H01L23/53233 , H01L23/53242 , H01L23/53247 , H01L23/5328 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L25/03 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2225/1035 , H01L2225/1058 , H01L2924/1434 , H01L2924/15311 , H01L2924/3025
摘要： A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.
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公开(公告)号：US20210344847A1
公开(公告)日：2021-11-04
申请号：US17075776
申请日：2020-10-21
发明人： Tae Hoon KIM , Joon Seok CHAE
摘要： A vehicle camera system includes: an around view camera device including a front camera, a left camera, a right camera, and a rear camera, and configured to vary a field of view of one or more of the cameras in response to a control signal; and a control device configured to control the field of view by generating the control signal, in response to an operating mode.
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公开(公告)号：US20170301453A1
公开(公告)日：2017-10-19
申请号：US15232325
申请日：2016-08-09
发明人： Dae Hui JO , Han LEE , Mi Sun HWANG , Jeong Min CHO , Myung Sam KANG , Seok Hwan AHN , Tae Hoon KIM
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/041 , H01F2027/2809
摘要： A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.
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公开(公告)号：US20160351321A1
公开(公告)日：2016-12-01
申请号：US15093275
申请日：2016-04-07
发明人： Soo Hyun LYOO , Se Woong PAENG , Jung Min KIM , Jeong Gu YEO , Tae Hoon KIM , Sang Jun LEE , Ji Hyung JUNG , Ji Man RYU , Do Young JUNG
CPC分类号： H01F27/2804 , H01F27/292 , H01F41/041 , H01F2027/2809
摘要： An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.
摘要翻译： 电感器包括一个包括一个有机材料的主体和一个设置在本体中的线圈部分。 外部电极设置在主体的外表面上并连接到线圈部分。 线圈部分包括导电图案和导电通孔。 粘合层设置在导电图案和导电通孔之间，并且粘合剂层由与导电图案和导电通孔的材料不同的材料形成。
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公开(公告)号：US20150185176A1
公开(公告)日：2015-07-02
申请号：US14221007
申请日：2014-03-20
发明人： Tae Kon KOO , Tae Hoon KIM
IPC分类号： G01N27/22
CPC分类号： G01N27/223
摘要： There is provided a humidity sensor including: a substrate including an insulation film deposited on a surface thereof; a lower electrode formed on the substrate and including a contact extension part; a moisture sensing layer formed of a polymer material, provided on the lower electrode, and partially exposed through the contact extension part; and an upper electrode formed on the moisture sensing layer and including an open portion so as to partially expose the moisture sensing layer, wherein the contact extension part is in communication with the outside so that external air contacts the moisture sensing layer exposed through the contact extension part.
摘要翻译： 提供了一种湿度传感器，包括：基板，其包括沉积在其表面上的绝缘膜; 形成在所述基板上并包括接触延伸部的下电极; 由聚合物材料形成的湿度感测层，设置在下部电极上，并通过接触延伸部分露出; 以及形成在所述湿度感测层上的上电极，并且包括开口部分以部分地暴露所述湿度感测层，其中所述接触延伸部分与外部连通，使得外部空气接触通过所述接触延伸部暴露的湿度感测层 部分。
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9.发明申请公开(公告)号：US20140113393A1
公开(公告)日：2014-04-24
申请号：US14146111
申请日：2014-01-02
发明人： Ji Hyun PARK , Seog Moon CHOI , Tae Hoon KIM , Sang Hyun SHIN , Tae Hyun KIM
IPC分类号： H01L33/58
CPC分类号： H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.
摘要翻译： 本文公开了一种制造用于光学元件的封装衬底的方法。 该方法包括以下步骤：提供导电衬底，在导电衬底中形成空腔，并在导电衬底上形成绝缘层。 该方法还包括以下步骤：使用电镀工艺在导电衬底上形成电路层和电极焊盘，在电路层中形成包括下部和侧壁的空腔，以及将光学元件安装在空腔中， 然后在其上施加荧光树脂层。
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10.发明申请公开(公告)号：US20130045550A1
公开(公告)日：2013-02-21
申请号：US13654313
申请日：2012-10-17
发明人： Ji Hyun PARK , Seog Moon CHOI , Tae Hoon KIM , Sang Hyun SHIN , Tae Hyun KIM
IPC分类号： H01L33/58
CPC分类号： H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate 11 and has a cavity space therein; electrode pads which are formed on the conductive substrate and which are spaced apart from the circuit layer by predetermined intervals such that trenches are formed between the circuit layer and the electrode pads; an optical element which is mounted in the cavity space of the circuit layer and which is electrically connected with the electrode pads; and a fluorescent resin layer which is formed on the circuit layer and the optical element to allow the optical element to uniformly emit light. The package substrate is advantageous in that uniform white light can be realized.
摘要翻译： 本文公开了一种用于光学元件的封装基板，包括：导电基板，其上形成有绝缘层; 电路层，其形成在导电基板11上并具有空腔; 电极焊盘，其形成在导电衬底上并且与电路层隔开预定间隔，使得在电路层和电极焊盘之间形成沟槽; 光学元件，其安装在所述电路层的空腔中并与所述电极焊盘电连接; 以及形成在电路层和光学元件上以允许光学元件均匀发光的荧光树脂层。 封装基板的优点在于可以实现均匀的白光。
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