MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220246358A1

    公开(公告)日:2022-08-04

    申请号:US17726885

    申请日:2022-04-22

    IPC分类号: H01G4/30 H01G4/12 H01G4/012

    摘要: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as te and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210035740A1

    公开(公告)日:2021-02-04

    申请号:US16836085

    申请日:2020-03-31

    IPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

    Charging apparatus and wireless charging apparatus
    3.
    发明授权
    Charging apparatus and wireless charging apparatus 有权
    充电设备和无线充电设备

    公开(公告)号:US09236759B2

    公开(公告)日:2016-01-12

    申请号:US13829559

    申请日:2013-03-14

    IPC分类号: H02J7/00 H02J7/02 H02J5/00

    摘要: There is provided a charging apparatus and a wireless charging apparatus that facilitate display of a fully charged state using a monochromatic display device. The charging apparatus and the wireless charging apparatus include a power supply unit supplying a charging power, a charging unit supplying the charging power to an external charging target device, a charging control unit controlling a charging state of the charging unit, a display unit that displays the charging state under the control of the charging control unit and, when the charging target device is in a fully charged state, stops an operation of displaying the charging state, and a delay unit that delays stopping the operation of the display unit that displays the charging state, for a previously set period of time, when the charging target device in the fully charged state is recharged.

    摘要翻译: 提供了一种使用单色显示装置便于显示完全充电状态的充电装置和无线充电装置。 充电装置和无线充电装置包括提供充电电力的电源单元,向外部充电目标装置提供充电电力的充电单元,控制充电单元的充电状态的充电控制单元,显示单元,其显示 在充电控制单元的控制下的充电状态,并且当充电目标设备处于完全充电状态时,停止显示充电状态的操作,以及延迟单元,其延迟停止显示充电状态的显示单元的操作 当处于完全充电状态的充电目标装置被充电时,预先设定的时间段的充电状态。

    Manufacturing method of multilayer ceramic electronic component

    公开(公告)号:US11636983B2

    公开(公告)日:2023-04-25

    申请号:US17726888

    申请日:2022-04-22

    IPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

    ELECTRONIC DEVICE CASE, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICTIONS TERMINAL
    5.
    发明申请
    ELECTRONIC DEVICE CASE, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICTIONS TERMINAL 审中-公开
    电子设备案例,其制造方法和模具以及移动通信终端

    公开(公告)号:US20130335279A1

    公开(公告)日:2013-12-19

    申请号:US13973103

    申请日:2013-08-22

    IPC分类号: H01Q1/24

    摘要: An electronic device case having an antenna pattern embedded therein includes: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

    摘要翻译: 具有嵌入天线图案的电子设备壳体包括:散热器,其具有发送和接收信号的天线图案部分和允许信号被发送到电子设备的电路板并从其接收的连接端子部分; 连接部,其部分地形成所述散热器,并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 散热器框架,其通过在散热器上注射成型而制造,使得散热器的天线图案部分设置在散热器框架的一侧,并且连接端子部分设置在其另一侧上; 以及壳体框架,其覆盖设置有天线图案部分的辐射体框架的一侧,使得天线图案部分嵌入在壳体框架和散热器框架之间。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220246359A1

    公开(公告)日:2022-08-04

    申请号:US17726888

    申请日:2022-04-22

    IPC分类号: H01G4/30 H01G4/12 H01G4/012

    摘要: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

    Multilayer ceramic electronic component

    公开(公告)号:US11342121B2

    公开(公告)日:2022-05-24

    申请号:US16836085

    申请日:2020-03-31

    IPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.