公开(公告)号：US20130155573A1

公开(公告)日：2013-06-20

申请号：US13720405

申请日：2012-12-19

Applicant: Samsung Electro-Mechanics., CO., LTD.

Inventor： Hyun Tae Kim ,  Hee Jung Jung ,  Dae Bok Oh ,  Sang Hoon Kwon ,  Seoung Ho Kim ,  Jong Woo Choi

IPC: H01G13/00 ,  H01G4/008

CPC classification number: H01G13/00 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

Abstract: There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer.

Abstract translation: 提供了一种电子部件，其包括形成有多个内部电极的陶瓷烧结体和形成在陶瓷烧结体的外表面上的外部电极。 每个外部电极包括与内部电极电连接的铜（Cu）电极层，形成在电极层的外表面上的铜（Cu） - 锡（Sn）合金层和锡（Sn）镀层 形成在合金层的外表面上。