Abstract:
A multilayer ceramic capacitor has a 3-terminal, vertical, multilayer structure in which portions of lead portions are not covered by external electrodes but are exposed to a mounting surface of a ceramic body. Insulating portions are disposed between the external electrodes on the mounting surface of the ceramic body. The insulating portions have an overlap portion covering portions of the external electrodes. 0.005≦i/e≦0.7 is satisfied, where i is a width of the overlap portion, and e is a width of the external electrode partially covered by the overlap portion.
Abstract:
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 μm or more.
Abstract:
There is provided a multilayer ceramic capacitor, including a ceramic body, a plurality of first and second internal electrodes, and first and second external electrodes, wherein the first and second external electrodes include first and second internal layers including first and second internal head portions and first and second internal bands formed on both main surfaces of the ceramic body, and first and second external layers including first and second external head portions and first and second external bands formed on the first and second internal bands and having a distance shorter than a distance of the first and second internal bands, the first and second external layers having viscosity higher than that of the first and second internal layers.
Abstract:
A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.
Abstract:
A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes three external electrodes including a conductive layer, a nickel plating layer, and a tin plating layer sequentially stacked on a mounting surface of the ceramic body, and spaced apart from each other. When an outermost portion of a lead-out portion of an internal electrode exposed to the mounting surface is P, a total thickness of the conductive layer, the nickel plating layer, and the tin plating layer in a normal line direction of the conductive layer from P is a, a thickness of the conductive layer in the normal line direction of the conductive layer from P is b, and a sum of pore heights of pores existing in the conductive layer in the normal line direction of the conductive layer from P is bp, (b−bp)/a satisfies 0.264≦(b−bp)/a≦0.638.
Abstract:
There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between adjacent lead portions is 500.7 μm or less, widths of one-side margin portions of the external electrodes in a length direction of the ceramic body that are not in contact with the corresponding lead portions are 20.2 μm or more.
Abstract:
There is provided a multi-layered ceramic capacitor having a dual layer-electrode structure formed by applying a dual layer of electrode paste to the multi-layered ceramic capacitor. The multi-layered ceramic capacitor having a dual layer-electrode structure includes a capacitor body having a preset length and width and having a plurality dielectric layers stacked therein, an internal electrode unit formed on the plurality of dielectric layers and having a preset capacitance, and an external electrode unit including first external electrodes respectively formed on both sides of the capacitor body to be electrically connected to internal electrodes, and second external electrodes formed on the first external electrodes.
Abstract:
A multilayer ceramic capacitor includes: a ceramic body including a plurality of dielectric layers and a plurality of first and second internal electrodes stacked in a width direction; a pair of first external electrodes disposed on a mounting surface of the ceramic body to be spaced apart from one another and connected to the plurality of first internal electrodes; a second external electrode disposed between the pair of first external electrodes on the mounting surface of the ceramic body and connected to the plurality of second internal electrodes; and a dummy electrode disposed on a surface of the ceramic body opposing the mounting surface of the ceramic body.
Abstract:
There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between adjacent lead portions is 500.7 μm or less, widths of one-side margin portions of the external electrodes in a length direction of the ceramic body that are not in contact with the corresponding lead portions are 20.2 μm or more.
Abstract:
There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer.