公开(公告)号：US20240248051A1

公开(公告)日：2024-07-25

申请号：US18458565

申请日：2023-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyung AHN ,  Inseok PARK ,  Joonseo SONG ,  Souk KIM ,  Younghoon SOHN

IPC: G01N23/2251 ,  G06T7/00 ,  G06T7/80

CPC classification number: G01N23/2251 ,  G06T7/0004 ,  G06T7/80 ,  G01N2223/303 ,  G01N2223/401 ,  G01N2223/6116 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: A wafer measurement apparatus includes an electronic-optical system configured to irradiate a wafer with an electron beam and acquire a raw signal by detecting electrons emitted by the wafer, and an image processing device configured to convert the raw signal acquired by the electronic-optical system into image data. The electronic-optical system includes a detector configured to acquire the raw signal. The detector calibrates a gain offset using a difference in electron emission yields of different materials.

公开(公告)号：US20200176292A1

公开(公告)日：2020-06-04

申请号：US16532920

申请日：2019-08-06

Applicant: Samsung Electronics Co,Ltd.

Inventor： Sung Yoon RYU ,  Joonseo SONG ,  Souk KIM ,  Younghoon SOHN ,  Yusin YANG ,  Chihoon LEE

IPC: H01L21/67 ,  G01B11/24 ,  G06T7/00

Abstract: Disclosed are methods of inspecting semiconductor wafers, inspection systems for performing the same, and methods of fabricating semiconductor devices using the same. A method of inspecting a semiconductor wafer including preparing a wafer including zones each having patterns, obtaining representative values for the patterns, scanning the patterns under an optical condition to obtain optical signals for the patterns, each of the optical signals including optical parameters, selecting a representative optical parameter that is one of the optical parameters that has a correlation with the representative values, obtaining a reference value of the representative optical parameter for a reference pattern, and obtaining a defect of an inspection pattern by comparing the reference value with an inspection value of the representative optical parameter for the inspection pattern.