公开(公告)号：US20200176292A1

公开(公告)日：2020-06-04

申请号：US16532920

申请日：2019-08-06

Applicant: Samsung Electronics Co,Ltd.

Inventor： Sung Yoon RYU ,  Joonseo SONG ,  Souk KIM ,  Younghoon SOHN ,  Yusin YANG ,  Chihoon LEE

IPC: H01L21/67 ,  G01B11/24 ,  G06T7/00

Abstract: Disclosed are methods of inspecting semiconductor wafers, inspection systems for performing the same, and methods of fabricating semiconductor devices using the same. A method of inspecting a semiconductor wafer including preparing a wafer including zones each having patterns, obtaining representative values for the patterns, scanning the patterns under an optical condition to obtain optical signals for the patterns, each of the optical signals including optical parameters, selecting a representative optical parameter that is one of the optical parameters that has a correlation with the representative values, obtaining a reference value of the representative optical parameter for a reference pattern, and obtaining a defect of an inspection pattern by comparing the reference value with an inspection value of the representative optical parameter for the inspection pattern.

公开(公告)号：US20170363418A1

公开(公告)日：2017-12-21

申请号：US15464896

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yoon RYU ,  Younghoon SOHN ,  Yusin YANG ,  Chungsam JUN ,  Yunjung JEE

IPC: G01B11/06

CPC classification number: G01B11/06 ,  G01B9/02001 ,  G01B9/02021 ,  G01B11/0616 ,  G01B11/0625 ,  G01B11/0675 ,  G01B2210/56

Abstract: Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

公开(公告)号：US20170309523A1

公开(公告)日：2017-10-26

申请号：US15437566

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon SOHN ,  Jinsung KIM ,  Yusin YANG ,  Chungsam JUN

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/027 ,  H01L21/311 ,  H01L21/768 ,  H01L21/67 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L21/02

CPC classification number: H01L22/12 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02271 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/4846 ,  H01L21/565 ,  H01L21/67259 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76895 ,  H01L22/20 ,  H01L24/06 ,  H01L24/11 ,  H01L2221/68345 ,  H01L2224/02311 ,  H01L2224/13024 ,  H01L2224/14131 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/152 ,  H01L2924/15747

Abstract: A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.

公开(公告)号：US20250123243A1

公开(公告)日：2025-04-17

申请号：US18670118

申请日：2024-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeon Bo SHIM ,  Souk KIM ,  Younghoon SOHN ,  Jaeho KIM ,  Inseok PARK ,  Jaewon YANG ,  Minho RIM

IPC: G01N29/04 ,  G01N29/24

Abstract: A semiconductor substrate inspection device is provided and includes: a function generator that generates a first signal and a second signal; an ultrasonic generator that receives the first signal generated from the function generator, generates an ultrasonic wave based on the first signal, and generates a surface wave signal on an upper surface of a substrate using the ultrasonic wave; and an electron beam measurer that inspects the surface wave signal, wherein the electron beam measurer includes: a laser light source that receives the second signal generated from the function generator and generates a first pulse laser beam based on the second signal; an electron beam generator that receives the first pulse laser beam and generates an electron beam that is emitted onto the upper surface of the substrate; and a backscattered electron detector that detects backscattered electrons generated based on the electron beam being incident on the substrate.

公开(公告)号：US20230154804A1

公开(公告)日：2023-05-18

申请号：US17895486

申请日：2022-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeho KIM ,  Souk KIM ,  Younghoon SOHN

IPC: H01L21/66 ,  H01L27/11582 ,  H01L27/11565 ,  G01J3/18

CPC classification number: H01L22/12 ,  H01L27/11582 ,  H01L27/11565 ,  G01J3/18 ,  G02B5/18

Abstract: A spectroscopic device may include a light source part configured to emit a first light toward a target object, the light source part including a main light source and a plurality of auxiliary light sources, a diffraction part including a diffraction grating configured to diffract a second light that is produced based on the first light being reflected from the target object, the diffraction grating configured to produce a third light that is the diffracted second light, a detection part configured to detect the third light, and an analyzing part connected to the detection part. The detection part may include a plurality of pixels and an actuator. The plurality of auxiliary light sources may be configured to emit light rays of different wavelengths. The actuator may be configured to rotate and move the detection part.

公开(公告)号：US20180005369A1

公开(公告)日：2018-01-04

申请号：US15626675

申请日：2017-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon SOHN ,  Yusin YANG

IPC: G06T7/00

CPC classification number: G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/30 ,  H01L24/19 ,  H01L2224/18

Abstract: An inspection method includes generating first layout data including information on a shape of a first pattern group, generating second layout data including information on a shape of a second pattern group, obtaining a target image including images of the first and second pattern groups, and detecting a defect pattern from the target image by comparing the first and second layout data with the target image. The first pattern group, the second pattern group, and the defect pattern are provided at different heights from each other, from a top surface of a substrate.

公开(公告)号：US20220404395A1

公开(公告)日：2022-12-22

申请号：US17721522

申请日：2022-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyoon RYU ,  Seungbum HONG ,  Kwangeun KIM ,  Hoon KIM ,  Jiwon YEOM ,  Seokjung YUN ,  Souk KIM ,  Younghoon SOHN ,  Yusin YANG

IPC: G01R1/067 ,  G01R1/04

Abstract: A test apparatus includes a movable stage to support a sample, tips above the stage that have different shapes and alternately perform profiling and milling on the sample, a tip stage connected to a cantilever coupled to the tips, the tip stage to adjust a position of the cantilever, a position sensor to obtain information about a positional relationship between the tips and the sample, a stage controller to control movements of the stage and the tip stage, based on the information about the positional relationship, and a tip controller to select the tips for performing the profiling or milling and to determine conditions for performing milling, wherein a depth of the sample being processed by the milling in the first direction is controlled based on a relationship between a distance between the tips and the sample and a force between the tips and the sample.

公开(公告)号：US20210140899A1

公开(公告)日：2021-05-13

申请号：US16887284

申请日：2020-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangik PARK ,  Sungyoon RYU ,  Younghoon SOHN ,  Yusin YANG

IPC: G01N21/956 ,  G01N21/95 ,  G01N21/21

Abstract: A substrate inspection device including a light source, a polarizer, first and second compensators, an analyzer, a light splitter configured to receive reflected light reflected by the substrate to split the reflected light into first split light and second split light, a first detector and a second detector configured to detect the first split light and the second split light, respectively, and a controller configured to control the first and second detectors differently from each other, may be provided.

公开(公告)号：US20200209165A1

公开(公告)日：2020-07-02

申请号：US16709222

申请日：2019-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghoon SOHN ,  Yusin YANG ,  Chihoon LEE

IPC: G01N21/95 ,  G01N21/45 ,  H01L21/67

Abstract: Disclosed are a substrate inspection method and a method of fabricating a semiconductor device using the same. The inspection method may include measuring a target area of a substrate using a pulsed beam to obtain a first peak, measuring a near field ultrasound, which is produced by the pulsed beam in a near field region including the target area, using a first continuous wave beam different from the pulsed beam to obtain a second peak, and measuring a far field ultrasound, which is produced by the near field ultrasound in a far field region outside the near field region, using a second continuous wave beam to examine material characteristics of the substrate.

公开(公告)号：US20240248051A1

公开(公告)日：2024-07-25

申请号：US18458565

申请日：2023-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyung AHN ,  Inseok PARK ,  Joonseo SONG ,  Souk KIM ,  Younghoon SOHN

IPC: G01N23/2251 ,  G06T7/00 ,  G06T7/80

CPC classification number: G01N23/2251 ,  G06T7/0004 ,  G06T7/80 ,  G01N2223/303 ,  G01N2223/401 ,  G01N2223/6116 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: A wafer measurement apparatus includes an electronic-optical system configured to irradiate a wafer with an electron beam and acquire a raw signal by detecting electrons emitted by the wafer, and an image processing device configured to convert the raw signal acquired by the electronic-optical system into image data. The electronic-optical system includes a detector configured to acquire the raw signal. The detector calibrates a gain offset using a difference in electron emission yields of different materials.