公开(公告)号：US11275458B2

公开(公告)日：2022-03-15

申请号：US16642104

申请日：2018-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kem-Suk Seo ,  Bong-Jae Rhee ,  Sun-A Kim ,  Jeong-Hoo Kim ,  Chi-Hyun Cho

IPC: G06F3/041 ,  G06F21/32 ,  G06K9/00

Abstract: There is provided a device that includes: a display; at least one sensor disposed to be adjacent to the display; a biometric sensor disposed in at least a partial region of the display; and at least one processor, wherein the at least one processor can be set up to receive an input in the at least a partial region from an external object, by using the at least one sensor or the biometric sensor, and to obtain biometrics of the external object by using the biometric sensor on the basis, at least partially, of the input by the external object.

公开(公告)号：US10685205B2

公开(公告)日：2020-06-16

申请号：US16038753

申请日：2018-07-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Eui Lee ,  Young-Min Seo ,  Young-Soo Lee ,  Yong-Cheol Park ,  Bong-Jae Rhee

IPC: G06K9/00 ,  G02F1/1333 ,  G06F3/041

Abstract: An electronic device is provided. The electronic device includes an optical sensor, the optical sensor comprising a lighting device configured to emit light, a sensor layer including an array of sensors configured to detect first image information corresponding to an object from light reflected by the object, and a filter layer including openings configured to transmit the light reflected by the object, the filter layer disposed on the sensor layer, wherein the first image information is different from an image of the object identified with naked eyes. The electronic device may be diversified according to embodiments.

公开(公告)号：US09503141B2

公开(公告)日：2016-11-22

申请号：US14596200

申请日：2015-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bong-Jae Rhee

IPC: H01R13/648 ,  H04B1/3816 ,  H01R12/71

CPC classification number: H04B1/3816 ,  H01R12/714 ,  H01R2201/16

Abstract: A socket device is provided. The socket device includes a substrate, at least one structure, and a socket. The at least one structure is disposed on the substrate, and includes an upper surface. The upper surface includes an opening separated with a predetermined interval from a surface of the substrate. The socket is disposed so that at least a portion of the socket is stacked on an upper portion of the structure. The socket is electrically connected to the substrate via the opening. The number of parts is reduced, so that the number of assembly processes is reduced and assembling is convenient, and manufacturing costs is reduced and slimness of an electronic device is achieved.

Abstract translation: 提供插座装置。 插座装置包括基板，至少一个结构和插座。 所述至少一个结构设置在所述基板上，并且包括上表面。 上表面包括从衬底的表面以预定间隔分开的开口。 插座设置成使得插座的至少一部分堆叠在结构的上部。 插座经由开口电连接到基板。 减少零件数量，减少组装工序，组装方便，降低了制造成本，实现了电子装置的薄型化。

公开(公告)号：US20160029511A1

公开(公告)日：2016-01-28

申请号：US14809094

申请日：2015-07-24

Applicant: Samsung Electronics Co., Ltd ,  TTM Co., Ltd

Inventor： Chung-Hyo Jung ,  Eu-Gene Choi ,  Bong-Jae Rhee

IPC: H05K7/20 ,  F28F23/00 ,  F28F21/00

CPC classification number: F28F23/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat transfer apparatus is provided. The heat transfer apparatus includes a first thermal conductor. The heat transfer apparatus also includes a second thermal conductor. The heat transfer apparatus further includes an interface member configured to transfer heat between the first thermal conductor and the second thermal conductor. A portion of the interface member contains a thermoplastic material reacting via an application of the heat.

Abstract translation: 提供传热装置。 传热装置包括第一热导体。 传热装置还包括第二热导体。 传热装置还包括被配置为在第一热导体和第二热导体之间传递热量的界面构件。 界面部件的一部分包含通过施加热量而反应的热塑性材料。

公开(公告)号：US20150200479A1

公开(公告)日：2015-07-16

申请号：US14596200

申请日：2015-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bong-Jae Rhee

IPC: H01R12/72 ,  H01R13/6581

CPC classification number: H04B1/3816 ,  H01R12/714 ,  H01R2201/16

Abstract: A socket device is provided. The socket device includes a substrate, at least one structure, and a socket. The at least one structure is disposed on the substrate, and includes an upper surface. The upper surface includes an opening separated with a predetermined interval from a surface of the substrate. The socket is disposed so that at least a portion of the socket is stacked on an upper portion of the structure. The socket is electrically connected to the substrate via the opening. The number of parts is reduced, so that the number of assembly processes is reduced and assembling is convenient, and manufacturing costs is reduced and slimness of an electronic device is achieved.

Abstract translation: 提供插座装置。 插座装置包括基板，至少一个结构和插座。 所述至少一个结构设置在所述基板上，并且包括上表面。 上表面包括从衬底的表面以预定间隔分开的开口。 插座设置成使得插座的至少一部分堆叠在结构的上部。 插座经由开口电连接到基板。 减少零件数量，减少组装工序，组装方便，降低了制造成本，实现了电子装置的薄型化。

公开(公告)号：US10136541B2

公开(公告)日：2018-11-20

申请号：US14329562

申请日：2014-07-11

Applicant: Samsung Electronics Co., ltd.

Inventor： Bong-Jae Rhee

IPC: H05K1/14 ,  H05K7/14 ,  H01R13/52 ,  H04M1/02 ,  H05K5/02 ,  H05K5/03 ,  H05K1/11

Abstract: An electronic device includes a Printed Circuit Board (PCB), a housing, an inner cover, and an outer cover. The PCB mounts a first socket and a second socket thereon. The housing includes a first slot disposed to correspond to the first socket and a second slot disposed to correspond to the second socket. The housing receives the PCB. The inner cover opens/closes the first slot. The outer cover opens/closes the second slot. The first socket and the second socket are open toward the first slot and the second slot, respectively. When the outer cover is open, the inner cover is exposed and is in an openable state.

公开(公告)号：US09285901B2

公开(公告)日：2016-03-15

申请号：US14096577

申请日：2013-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bong-Jae Rhee

IPC: G06F3/033 ,  G06F3/0354 ,  G06F3/043

CPC classification number: G06F3/03545 ,  G06F3/043 ,  G06F3/0433

Abstract: An electronic device for receiving an input by a digital pen having a waveform generation means is provided. The electronic device includes at least three reception sensors and a processor. The at least three reception sensors are installed in the electronic device at positions that are separated from one another, and are configured to receive a waveform generated by the waveform generator of the digital pen. The processor is configured to calculate an input coordinate of the digital pen using a difference of velocities and reception times of the waveform received by the at least three reception sensors.

Abstract translation: 提供一种用于由具有波形发生装置的数字笔接收输入的电子装置。 电子设备包括至少三个接收传感器和处理器。 至少三个接收传感器安装在电子设备中彼此分离的位置处，并被配置为接收由数字笔的波形发生器产生的波形。 处理器被配置为使用由至少三个接收传感器接收的波形的速度和接收时间的差来计算数字笔的输入​​坐标。

公开(公告)号：US20150014051A1

公开(公告)日：2015-01-15

申请号：US14329562

申请日：2014-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bong-Jae Rhee

IPC: H05K7/14 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K7/1427 ,  H01R13/5213 ,  H04M1/0274 ,  H05K1/116 ,  H05K5/0291 ,  H05K5/03 ,  H05K2201/10159

Abstract: An electronic device includes a Printed Circuit Board (PCB), a housing, an inner cover, and an outer cover. The PCB mounts a first socket and a second socket thereon. The housing includes a first slot disposed to correspond to the first socket and a second slot disposed to correspond to the second socket. The housing receives the PCB. The inner cover opens/closes the first slot. The outer cover opens/closes the second slot. The first socket and the second socket are open toward the first slot and the second slot, respectively. When the outer cover is open, the inner cover is exposed and is in an openable state.

Abstract translation: 电子设备包括印刷电路板（PCB），外壳，内盖和外盖。 PCB在其上安装第一插座和第二插座。 壳体包括设置成对应于第一插座的第一槽和设置成对应于第二插座的第二槽。 外壳接收PCB。 内盖打开/关闭第一个插槽。 外盖打开/关闭第二个插槽。 第一插座和第二插座分别朝向第一插槽和第二插槽开口。 当外盖打开时，内盖露出并处于可打开状态。