公开(公告)号：US20150155210A1

公开(公告)日：2015-06-04

申请号：US14337571

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Masato KAJINAMI ,  Yoshiaki YUKIMORI ,  Sang-Yoon KIM ,  Hui-Jae KIM ,  Byeong-Kuk PARK ,  Seung Dae SEOK ,  Jae Bong SHIN ,  Byeong Kap CHOI

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/67259 ,  H01L21/67109 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/73204 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81127 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83127 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H05K13/046 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。

公开(公告)号：US20130230618A1

公开(公告)日：2013-09-05

申请号：US13780603

申请日：2013-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Yun LEE ,  Seong Wook CHEONG ,  Byeong Kap CHOI ,  Sang Jin CHOI

IPC: B29C45/26

CPC classification number: B29C45/26 ,  B29C45/02 ,  B29C45/06 ,  B29C45/14655 ,  B29C45/2681 ,  B29C45/46

Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.

Abstract translation: 一种用于制造半导体封装的装置，至少包括第一模具，转子和驱动器。 第一模具具有第一模具部分，第二模具部分和当第一模具部分和第二模具组合在一起时形成的至少一个模腔。 旋转器联接到第一模具，并且驱动器在第一模具和旋转体的旋转轴线之间。 驱动器基于旋转体在旋转轴线上旋转时产生的离心力将模制树脂提供到腔体中。