公开(公告)号：US20150159681A1

公开(公告)日：2015-06-11

申请号：US14562179

申请日：2014-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato KAJINAMI ,  Fumitaka MOROISHI ,  Keiji MURATA ,  Shinji UEYAMA ,  Tatsuya ISHIMOTO ,  Yoshiaki YUKIMORI

IPC: F15B15/28 ,  F15B15/06

CPC classification number: F15B15/088 ,  F15B15/063 ,  F15B15/1452 ,  F15B15/1461 ,  F15B15/2846 ,  F15B15/2876 ,  F15B2211/6336 ,  F15B2211/665 ,  F15B2211/6651 ,  F15B2211/8855

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

Abstract translation: 一种流体压力致动器，包括具有第一位置检测器和第二位置检测器的流体压力缸，具有活塞头和杆的活塞体，所述活塞头安装在所述杆上并可滑动地容纳在所述流体压力缸中，所述杆包括 第一刻度和第二刻度，所述第一刻度面向所述第一位置检测器和所述第一位置检测器，所述第一位置检测器被配置为检测所述活塞体的滑动方向上的位置，所述第二刻度尺面向所述第二位置检测器，所述第二位置检测器被配置为 检测杆在活塞体的旋转方向上的位置，并且可以设置用于执行杆在滑动方向上的位置的第一定位控制和杆沿旋转方向的第二定位控制的控制器 。

公开(公告)号：US20150024551A1

公开(公告)日：2015-01-22

申请号：US14283238

申请日：2014-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoshiaki YUKIMORI ,  Shinji UEYAMA ,  Masato KAJINAMI

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L24/93 ,  H01L21/561 ,  H01L21/78 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83203

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract translation: 一种制造半导体器件的方法包括：提供包括内部布线的第一基板，所述第一基板包括具有第一芯片安装区域的芯片安装区域阵列; 将第一衬底放置在第一载体线上; 提供第一半导体芯片; 将第一半导体芯片放置在第一可移动托盘上; 将第一基板的第一芯片安装区域与第一半导体芯片垂直对准，并且将第一半导体芯片初始接合到第一基板的第一芯片安装区域; 以及在所述第一基板的初始接合的第一半导体芯片和第一安装区域上进行后续的接合，从而在所述第一安装区域将所述第一半导体芯片与所述第一基板更牢固地接合。 在执行第一衬底上的至少一个其它半导体芯片的后续接合之后发生初始接合。

公开(公告)号：US20150155210A1

公开(公告)日：2015-06-04

申请号：US14337571

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Masato KAJINAMI ,  Yoshiaki YUKIMORI ,  Sang-Yoon KIM ,  Hui-Jae KIM ,  Byeong-Kuk PARK ,  Seung Dae SEOK ,  Jae Bong SHIN ,  Byeong Kap CHOI

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/67259 ,  H01L21/67109 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/73204 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81127 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83127 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H05K13/046 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。