公开(公告)号：US20150155210A1

公开(公告)日：2015-06-04

申请号：US14337571

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Masato KAJINAMI ,  Yoshiaki YUKIMORI ,  Sang-Yoon KIM ,  Hui-Jae KIM ,  Byeong-Kuk PARK ,  Seung Dae SEOK ,  Jae Bong SHIN ,  Byeong Kap CHOI

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/67259 ,  H01L21/67109 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/73204 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81127 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83127 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H05K13/046 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。

公开(公告)号：US20180174871A1

公开(公告)日：2018-06-21

申请号：US15838713

申请日：2017-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joong-Ha LEE ,  Sang-Yoon KIM ,  YoungBum KIM ,  Hui-Jae KIM ,  SeungDae SEOK ,  Jaebong SHIN ,  Byungjoon LEE ,  Yongin LEE ,  Jaeyeon PYO

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67144 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/681 ,  H01L21/6838 ,  H01L27/148

Abstract: A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.