公开(公告)号：US10971382B2

公开(公告)日：2021-04-06

申请号：US16245339

申请日：2019-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US11501987B2

公开(公告)日：2022-11-15

申请号：US17200032

申请日：2021-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US20210202283A1

公开(公告)日：2021-07-01

申请号：US17200032

申请日：2021-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US20200020555A1

公开(公告)日：2020-01-16

申请号：US16245339

申请日：2019-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.