公开(公告)号：US11037766B2

公开(公告)日：2021-06-15

申请号：US16268790

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Nam Kim ,  Sung-Yeon Kim ,  Hyung-Jun Kim ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Jung-Pyo Hong

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.

公开(公告)号：US10971382B2

公开(公告)日：2021-04-06

申请号：US16245339

申请日：2019-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US20170301578A1

公开(公告)日：2017-10-19

申请号：US15396929

申请日：2017-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Pyo HONG ,  Sang-Dong Kwon ,  Kwang-Nam Kim ,  Jong-Woo Sun ,  Sang-Rok Oh

IPC: H01L21/687 ,  H01J37/32 ,  B08B9/08 ,  B08B7/00 ,  H01L21/67

CPC classification number: H01L21/68721 ,  B08B7/00 ,  B08B9/08 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32633 ,  H01J37/32642 ,  H01J37/32733 ,  H01J37/32853 ,  H01J37/32862 ,  H01J37/3288 ,  H01J2237/002 ,  H01J2237/334 ,  H01L21/67069

Abstract: A method of processing a substrate including loading the substrate into a plasma-processing apparatus. The plasma-processing apparatus includes a focus ring. The substrate is processed in the plasma-processing apparatus using plasma. The substrate is unloaded from the plasma-processing apparatus. A layer is formed on the focus ring. The layer is formed by an in-situ process in the plasma-processing apparatus.

公开(公告)号：US11501987B2

公开(公告)日：2022-11-15

申请号：US17200032

申请日：2021-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US20210202283A1

公开(公告)日：2021-07-01

申请号：US17200032

申请日：2021-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US20200020555A1

公开(公告)日：2020-01-16

申请号：US16245339

申请日：2019-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-nam Kim ,  Byeong-Hee Kim ,  Jeongryul Kim ,  Hae-Joong Park ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Sung-Wook Jung ,  Nam-Young Cho ,  Jung-Pyo Hong

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

公开(公告)号：US10062550B2

公开(公告)日：2018-08-28

申请号：US15142629

申请日：2016-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Pyo Hong ,  Kwang-Nam Kim ,  Sang-Dong Kwon ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Yong-Moon Jang

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32009 ,  H01J37/321 ,  H01J37/32119 ,  H01L21/67248

Abstract: Provided are substrate processing apparatuses including a temperature measurement unit. The substrate processing apparatus comprises a chamber including a substrate processing region, a dielectric sheet that is disposed on the substrate processing region and includes an insertion hole and a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet, and has a screw portion inserted into the insertion hole, wherein each of the insertion hole and the screw portion has thread helixes meshed with each other.