公开(公告)号：US11133296B2

公开(公告)日：2021-09-28

申请号：US16698749

申请日：2019-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chanhee Jeong ,  Hyunki Kim ,  Junwoo Park ,  Byoung Wook Jang ,  Sunchul Kim ,  Su-Min Park ,  Pyoungwan Kim ,  Inku Kang ,  Heeyeol Kim

IPC: H01L25/10 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498

Abstract: A semiconductor package includes a semiconductor chip disposed on a first substrate, a mold layer covering a sidewall of the semiconductor chip and including a through-hole, a second substrate disposed on the semiconductor chip, a connection terminal disposed between the first substrate and the second substrate and provided in the through-hole, and an underfill resin layer extending from between the semiconductor chip and the second substrate into the through-hole.

公开(公告)号：US10510672B2

公开(公告)日：2019-12-17

申请号：US15956414

申请日：2018-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Uk Kim ,  Sunchul Kim ,  Jinkyeong Seol ,  Byoung Wook Jang

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and a method manufacturing the same are disclosed. At least one semiconductor chip is mounted on a package substrate. An insulative mold layer is formed at sides of the semiconductor chip having at least one recess in a region in which conductive connection members are formed, the recess defining one or more protrusions within the mold layer. An interposer is positioned on the protrusions with the conductive connection members connecting and providing electrical connections between conductive pads on the upper surface of the package and conductive pads on the lower surface of the package substrate. The protrusions may position the interposer in the vertical direction by defining the vertical spacing between the lower surface of the interposer and the upper surface of the package substrate. The protrusions may also position the interposer in one or more horizontal directions and/or prevent substantial movement during connecting of the interposer to the package substrate. An under-fill resin layer may be injected into remaining space between the interposer and the package substrate.

公开(公告)号：US11469133B2

公开(公告)日：2022-10-11

申请号：US16805951

申请日：2020-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok Geun Ahn ,  Min Keun Kwak ,  Ji Won Shin ,  Sang Hoon Lee ,  Byoung Wook Jang

IPC: H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L21/683 ,  H01L21/67 ,  B23K37/047 ,  H01L23/00 ,  B23K101/40

Abstract: A bonding apparatus includes a body part; a vacuum hole disposed in the body part; a first protruding part protruding in a first direction from a first surface of the body part; a second protruding part protruding from the first surface of the body part in the first direction and spaced farther apart from a center of the first surface of the body part than the first protruding part in a second direction intersecting with the first direction; and a trench defined by the first surface of the body part and second surfaces of the first protruding part, the second surfaces protruding in the first direction from the first surface of the body part, and the trench being connected to the vacuum hole, wherein the second protruding part protrudes farther from the first surface of the body part in the first direction than the first protruding part.