公开(公告)号：US20170133249A1

公开(公告)日：2017-05-11

申请号：US15335988

申请日：2016-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： YOUNGMIN KIM ,  JaeYong PARK ,  KUNHO SONG ,  Byung-Joo JO

IPC: H01L21/67 ,  B32B38/00 ,  B28D5/02 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B32B37/12 ,  H01L21/687

CPC classification number: H01L21/67132 ,  B28D5/0082 ,  B28D5/022 ,  B32B37/1009 ,  B32B38/0004 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/742 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1062 ,  Y10T156/1322

Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.