公开(公告)号：US20230063376A1

公开(公告)日：2023-03-02

申请号：US17661080

申请日：2022-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGMIN KIM ,  HONGJONG PARK ,  ILJIN LEE

IPC: H04B1/40 ,  H04B1/04 ,  H04L27/26

Abstract: The present disclosure provides a communication device and an operating method. The communication device includes an antenna, a transmission processor, a radio frequency chain, and a reception processor. The transmission processor is configured to output a second transmission input signal with the same average power as the average power of a first transmission input signal and a second amplitude greater than a first amplitude of the first transmission input signal. The RF chain is configured to output an RF output signal to be transmitted through the antenna, based on a transmission input signal, and to output a reception input signal based on a signal received through the antenna. The reception processor is configured to check an out-of-band blocker by detecting a peaked frequency spectrum based on the reception input signal and to adjust a reception characteristic parameter of the RF chain based on an amplitude of the peaked frequency spectrum.

公开(公告)号：US20240321722A1

公开(公告)日：2024-09-26

申请号：US18481872

申请日：2023-10-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOONYOUNG JEON ,  YOUNGMIN KIM ,  JOON SEOK OH ,  CHANGBO LEE

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49894 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package includes a semiconductor chip, and a redistribution structure connected to the semiconductor chip. The redistribution structure may include an under bump pattern, a first redistribution layer disposed on the under bump pattern and including a first redistribution pad, a partition disposed inside the first redistribution pad and including a material that is different from that of the first redistribution pad, a contact via disposed on the first redistribution pad and the partition, and a second redistribution layer including a second redistribution pad disposed on the contact via.

公开(公告)号：US20170133249A1

公开(公告)日：2017-05-11

申请号：US15335988

申请日：2016-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： YOUNGMIN KIM ,  JaeYong PARK ,  KUNHO SONG ,  Byung-Joo JO

IPC: H01L21/67 ,  B32B38/00 ,  B28D5/02 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B32B37/12 ,  H01L21/687

CPC classification number: H01L21/67132 ,  B28D5/0082 ,  B28D5/022 ,  B32B37/1009 ,  B32B38/0004 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/742 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1062 ,  Y10T156/1322

Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.