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公开(公告)号：US11600904B2
公开(公告)日：2023-03-07
申请号：US17106235
申请日：2020-11-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Heecheul Moon , Sangyoup Seok , Kwonho Son , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Chongo Yoon , Jongchul Choi
Abstract: An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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公开(公告)号：US11018415B2
公开(公告)日：2021-05-25
申请号：US17082520
申请日：2020-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungbin Kim , Chongo Yoon , Sumin Yun , Hyunseock Roh , Gyubok Park , Jinwoo Jung , Jaebong Chun , Hochul Hwang
Abstract: An electronic device is provided. The electronic device includes a housing structure that includes a ceramic portion including a ceramic material, and a polymer portion formed on an inner surface of the ceramic portion and including a polymer material, and an antenna structure that is disposed within the housing structure and radiates a radio frequency (RF) signal to an outside of the housing structure. The housing structure includes a first portion including at least a portion of a region through which the RF signal passes, and a second portion formed around the first portion. In the first portion, a ratio of a thickness of the polymer portion to an entire thickness of the first portion is a first ratio. In the second portion, a ratio of a thickness of the polymer portion to an entire thickness of the second portion is a second ratio.
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公开(公告)号：US12046801B2
公开(公告)日：2024-07-23
申请号：US18117521
申请日：2023-03-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Heecheul Moon , Sangyoup Seok , Kwonho Son , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Chongo Yoon , Jongchul Choi
CPC classification number: H01Q1/243 , G06F1/1637 , G06F1/1683 , H01Q1/38 , H01Q9/0407
Abstract: An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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公开(公告)号：US11611142B2
公开(公告)日：2023-03-21
申请号：US17327022
申请日：2021-05-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungbin Kim , Chongo Yoon , Sumin Yun , Hyunseock Roh , Gyubok Park , Jinwoo Jung , Jaebong Chun , Hochul Hwang
Abstract: An electronic device is provided. The electronic device includes a housing structure that includes a ceramic portion including a ceramic material, and a polymer portion formed on an inner surface of the ceramic portion and including a polymer material, and an antenna structure that is disposed within the housing structure and radiates a radio frequency (RF) signal to an outside of the housing structure. The housing structure includes a first portion including at least a portion of a region through which the RF signal passes, and a second portion formed around the first portion. In the first portion, a ratio of a thickness of the polymer portion to an entire thickness of the first portion is a first ratio. In the second portion, a ratio of a thickness of the polymer portion to an entire thickness of the second portion is a second ratio.
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公开(公告)号：US11380980B2
公开(公告)日：2022-07-05
申请号：US17238428
申请日：2021-04-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heecheul Moon , Kwonho Son , Chongo Yoon , Mincheol Seo , Minwoo Yoo
IPC: H01Q1/24
Abstract: An electronic device includes a housing including a first plate facing in a first direction, a second plate facing in a second direction, and a side member surrounding a space between the first plate and the second plate, a support member interposed between the first plate and the second plate and including a metallic structure, an antenna structure mounted on the support member and including a first surface facing in a third direction toward the side member, and a polymer structure disposed in a space surrounded by the first plate, the support member, the side member, and the first surface of the antenna structure, and coupled to the metallic structure. The coupled metallic structure and polymer structure includes a groove bounded by the first surface, a second surface on the polymer structure forming an acute angle with the first surface, and a third surface substantially perpendicular to the second surface.
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Patent Agency Ranking
公开(公告)号：US10992028B2
公开(公告)日：2021-04-27
申请号：US16789729
申请日：2020-02-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heecheul Moon , Kwonho Son , Chongo Yoon , Mincheol Seo , Minwoo Yoo
IPC: H01Q1/24
Abstract: An electronic device includes a housing including a first plate facing in a first direction, a second plate facing in a second direction, and a side member surrounding a space between the first plate and the second plate, a support member interposed between the first plate and the second plate and including a metallic structure, an antenna structure mounted on the support member and including a first surface facing in a third direction toward the side member, and a polymer structure disposed in a space surrounded by the first plate, the support member, the side member, and the first surface of the antenna structure, and coupled to the metallic structure. The coupled metallic structure and polymer structure includes a groove bounded by the first surface, a second surface on the polymer structure forming an acute angle with the first surface, and a third surface substantially perpendicular to the second surface.
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公开(公告)号：US10854957B2
公开(公告)日：2020-12-01
申请号：US16778171
申请日：2020-01-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Heecheul Moon , Sangyoup Seok , Kwonho Son , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Chongo Yoon , Jongchul Choi
Abstract: An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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公开(公告)号：US12237564B2
公开(公告)日：2025-02-25
申请号：US18119126
申请日：2023-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chaeup Yoo , Hyungjin Kim , Chongo Yoon , Yoonjung Kim , Taeyoon Seo
Abstract: An electronic device includes: a housing; a substrate disposed in the housing; an antenna radiator; and an electrical connection member electrically interconnecting the antenna radiator and the substrate, wherein the electrical connection member includes: a plate portion including a first surface facing the antenna radiator and a second surface facing away from the first surface; a first fixing portion provided at a first end of the plate portion, the first fixing portion including a through hole and a tension structure; and a second fixing portion provided at a second end of the plate portion and electrically connecting the electrical connection member to the substrate, wherein the first fixing portion is fixed to the antenna radiator via a locking device that passes through the through hole, and wherein the tension structure is configured to contact the antenna radiator and maintain tension between the electrical connection member and the antenna radiator during fastening of the locking device.
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公开(公告)号：US12136770B2
公开(公告)日：2024-11-05
申请号：US17860850
申请日：2022-07-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungbin Kim , Kwangseo Kim , Jiho Kim , Seongyong An , Chongo Yoon , Gyubok Park , Jinwoo Jung
Abstract: An electronic device includes a housing including an internal space, a display disposed in the internal space, the display being visible from an outside of the electronic device through at least a part of the housing, at least one first antenna disposed in the internal space, a second antenna disposed in the internal space and wound multiple times and including a conductive pattern disposed to be spaced apart from the first antenna, a first wireless communication circuit configured to transmit or receive a wireless signal in a first frequency band via the at least one first antenna, and a second wireless communication circuit configured to transmit or receive a wireless signal in a second frequency band via the second antenna, wherein the at least one first antenna is spaced apart by a distance from the conductive pattern.
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10.发明授权公开(公告)号：US11974401B2
公开(公告)日：2024-04-30
申请号：US17643003
申请日：2021-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunghyup Lee , Chongo Yoon , Kwonho Son , Mincheol Seo , Yoonjung Kim , Hyungjin Kim , Jungsik Park , Sangyoup Seok , Donghun Shin , Seongyong An , Kyungjae Lee , Heeseok Jung , Huiwon Cho , Hyunju Hong
IPC: H05K1/02 , H01Q1/36 , H01Q1/48 , H01Q3/34 , H01Q3/44 , H01Q7/00 , H01Q9/42 , H01Q13/10 , H01Q21/28 , H01Q21/30 , H05K1/11 , H05K1/14 , H05K1/18 , H05K5/04
CPC classification number: H05K1/189 , H05K1/118 , H05K1/141 , H05K1/147 , H05K2201/10098 , H05K2201/10189
Abstract: An electronic device according to various embodiments may include: a first frame at least partially exposed to an outside of the electronic device and comprising a metal material, a flexible printed circuit board at least a portion of which is disposed adjacent to the first frame, a first connector electrically connecting the flexible printed circuit board and a main board of the electronic device, a bendable second connector electrically connecting the flexible printed circuit board and the first frame, a bolt including a bolt body extending through a groove formed in the second connector to be bolt-coupled to a bolt groove formed in the first frame and a bolt head formed integrally with the bolt body and disposed in a first direction with respect to the first frame, a plate disposed adjacent to the bolt head of the bolt and coupled to the first frame in the first direction to allow the bolt body of the bolt to be maintained in a state of being coupled to the bolt groove formed in the first frame, and an integrated circuit disposed on the flexible printed circuit board.
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