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公开(公告)号：US20240105567A1
公开(公告)日：2024-03-28
申请号：US18454464
申请日：2023-08-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Choong Bin YIM , Ji Yong PARK , Jong Bo SHIM
CPC classification number: H01L23/49816 , H01L21/4853 , H01L21/565 , H01L23/3107 , H01L23/49838 , H01L24/16 , H01L25/105 , H10B80/00 , H01L2224/1601 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/1433 , H01L2924/3511
Abstract: A semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.
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公开(公告)号：US20230111343A1
公开(公告)日：2023-04-13
申请号：US17961954
申请日：2022-10-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Choong Bin YIM , Ji Hwang KIM , Jin-woo PARK , Jong Bo SHIM
IPC: H01L25/10 , H01L25/00 , H01L23/00 , H01L21/56 , H01L23/538
Abstract: A semiconductor package includes a first wiring structure which includes a first insulating layer, and a first wiring pad inside the first insulating layer, a first semiconductor chip on the first wiring structure, a second wiring structure on the first semiconductor chip, and a connecting member between the first wiring structure and the second wiring structure. The second wiring structure includes a second insulating layer and a plurality of second wiring pads in the second insulating layer which each directly contact one surface of the first semiconductor chip.
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