公开(公告)号：US20240319229A1

公开(公告)日：2024-09-26

申请号：US18606516

申请日：2024-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chunghyun KIM ,  Cheolkyu LIM ,  Byungwook JEONG

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/06794 ,  G01R1/07342 ,  G01R31/2831

Abstract: A wafer testing apparatus includes a probe board disposed above a chamber, a wafer chuck disposed below the probe board and configured to support the wafer, a camera located between the probe board and the wafer chuck and configured to capture images of probe imaging points arranged on a lower surface of the probe board and wafer imaging points arranged on an upper surface of the wafer, and a controller electrically connected to the camera and configured to adjust a tilt of the probe board on the basis of image information acquired by the camera. The probe imaging points include a plurality of probe outer imaging points arranged in a rhombic pattern on the lower surface of the probe board, and the wafer imaging points include a plurality of wafer outer imaging points arranged in a rhombic pattern on the upper surface of the wafer.