公开(公告)号：US10950544B2

公开(公告)日：2021-03-16

申请号：US16445021

申请日：2019-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Ik Lee ,  Dai Hong Kim ,  Ji Woon Im ,  Se Mee Jang ,  Bo Ra Nam

IPC: H01L23/528 ,  H01L27/11582 ,  H01L21/768 ,  H01L23/522 ,  H01L27/11565

Abstract: A semiconductor device includes a gate pattern disposed over a lower structure, and including a gate electrode region and a gate pad region extending from the gate electrode region; and a vertical channel semiconductor layer having a side surface facing the gate electrode region of the gate pattern. The gate pad region includes a first pad region having a thickness greater than a thickness of the gate electrode region. The first pad region includes an upper surface, a lower surface opposing the upper surface, and an outer side surface. The outer side surface has a lower outer side surface and an upper outer side surface, divided from each other by a boundary portion. The lower outer side surface extends from the lower surface, and a connection portion of the lower outer side surface and the lower surface has a rounded shape.

公开(公告)号：US11107681B2

公开(公告)日：2021-08-31

申请号：US16578245

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Youn Seo ,  Ji Woon Im ,  Dai Hong Kim ,  Ik Soo Kim ,  Sang Ho Rha

IPC: H01L21/033 ,  H01L21/02

Abstract: A method of fabricating a semiconductor device and a semiconductor processing apparatus are provided. The method of fabricating a semiconductor device comprises preparing a semiconductor substrate having a front side and a back side, opposing each other, and forming a material layer on the semiconductor substrate. The material layer is formed on at least a portion of the back side of the semiconductor substrate while being formed on the front side of the semiconductor substrate. The material layer formed on the at least a portion of the back side of the semiconductor substrate is removed, while the material layer formed on the front side of the semiconductor substrate remains. A semiconductor process is performed to fabricate the semiconductor device using the material layer remaining on the front side of the semiconductor substrate.