MEMORY MODULE, MEMORY SYSTEM INCLUDING THE SAME, AND DATA STORAGE SYSTEM INCLUDING THE MEMORY MODULE
    1.
    发明申请
    MEMORY MODULE, MEMORY SYSTEM INCLUDING THE SAME, AND DATA STORAGE SYSTEM INCLUDING THE MEMORY MODULE 有权
    存储器模块,包括其的存储器系统和包括存储器模块的数据存储系统

    公开(公告)号:US20160247552A1

    公开(公告)日:2016-08-25

    申请号:US15000319

    申请日:2016-01-19

    CPC classification number: G11C11/4093 G11C5/04 G11C5/063 G11C7/02 G11C11/4076

    Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

    Abstract translation: 存储器模块包括第一印刷电路板(PCB),其包括第一表面,第二表面,形成在第一表面上的第一抽头和形成在第二表面上的第二抽头,附接到第一PCB的第一缓冲器,以及第一印刷电路板 附接到第一PCB的存储器件,其中第一缓冲器被配置为将通过第一抽头输入的信号和第二抽头传送到第一存储器件,并且由信号中的第一缓冲器重新驱动的信号被传输到第二 模块通过第二个水龙头。

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