Electronic device including housing and method for manufacturing housing thereof

    公开(公告)号:US11202376B2

    公开(公告)日:2021-12-14

    申请号:US16606565

    申请日:2018-04-06

    摘要: An electronic device according to various embodiments of the present invention comprises: a housing including a first plate facing in a first direction, a second plate facing in a second direction, and a side part surrounding a space between the first plate and the second plate; a display exposed through the first plate; a wireless communication circuit; and a processor, wherein the second plate includes: a first metal member and a second metal member, wherein the first metal member further includes a first side part facing a portion of the non-metallic extension part, and the second metal member further includes a second side part facing the first side part or another portion of the non-metallic extension part, and wherein the second plate includes an oxidized layer. The electronic device described above and the method for fabricating a housing of the electronic device may be diversified according to embodiments.