INTEGRATED CIRCUIT DEVICES
    3.
    发明申请

    公开(公告)号:US20220085011A1

    公开(公告)日:2022-03-17

    申请号:US17410326

    申请日:2021-08-24

    Abstract: An integrated circuit device includes substrate including a fin-type active area extending on the substrate in a first direction parallel to an upper surface of the substrate, a first gate line crossing the fin-type active area on the substrate and extending in a second direction perpendicular to the first direction, a cut gate line extending in the second direction and being spaced apart from the first gate line with a first gate cut area therebetween, a second gate line extending in the second direction and being spaced apart from the cut gate line with a second gate cut area therebetween, and a power wiring disposed on the cut gate line.

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